CY7C1383D-133AXI Cypress Semiconductor Corp, CY7C1383D-133AXI Datasheet - Page 11

• Manufacturer Part Number: CY7C1383D-133AXI
• Description: IC SRAM 18MBIT 133MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp
• Type: Synchronousr

Specifications of CY7C1383D-133AXI

• Memory Size: 18M (1M x 18)
• Package / Case: 100-LQFP
• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Access Time: 6.5 ns
• Maximum Clock Frequency: 133 MHz
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3.135 V
• Maximum Operating Current: 210 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Ports: 2
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 428-2149; CY7C1383D-133AXI

IEEE 1149.1 Serial Boundary Scan (JTAG)
The
incorporates a serial boundary scan test access port
(TAP).This part is fully compliant with 1149.1. The TAP
operates using JEDEC-standard 3.3V or 2.5V IO logic levels.
The
contains a TAP controller, instruction register, boundary scan
register, bypass register, and ID register.
Disabling the JTAG Feature
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(V
internally pulled up and may be unconnected. They may
alternately be connected to V
TDO may be left unconnected. Upon power up, the device will
come up in a reset state, which will not interfere with the
operation of the device.
TAP Controller State Diagram
The 0 or 1 next to each state represents the value of TMS at
the rising edge of TCK.
Test Access Port (TAP)
Test Clock (TCK)
The test clock is used only with the TAP controller. All inputs
are captured on the rising edge of TCK. All outputs are driven
from the falling edge of TCK.
Test MODE SELECT (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. This pin may be left
unconnected if the TAP is not used. The ball is pulled up inter-
nally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI ball is used to serially input information into the
registers and can be connected to the input of any of the
Document #: 38-05544 Rev. *F
SS
) to prevent clocking of the device. TDI and TMS are
1
0
CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F
CY7C1381D/CY7C1383D/CY7C1381F/CY7C1383F
TEST-LOGIC
RUN-TEST/
RESET
IDLE
0
1
1
0
CAPTURE-DR
UPDATE-DR
PAUSE-DR
DR-SCAN
SHIFT-DR
EXIT1-DR
EXIT2-DR
1
SELECT
0
0
1
0
1
1
DD
0
through a pull up resistor.
1
1
0
0
1
0
CAPTURE-IR
UPDATE-IR
PAUSE-IR
EXIT1-IR
EXIT2-IR
1
IR-SCAN
SHIFT-IR
SELECT
0
0
1
0
1
1
0
1
1
0
0
registers. The register between TDI and TDO is chosen by the
instruction that is loaded into the TAP instruction register. TDI
is internally pulled up and can be unconnected if the TAP is
unused in an application. TDI is connected to the most
significant bit (MSB) of any register. (See
Diagram.)
Test Data-Out (TDO)
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current
state of the TAP state machine. The output changes on the
falling edge of TCK. TDO is connected to the least significant
bit (LSB) of any register. (See
TAP Controller Block Diagram
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (V
edges of TCK. This Reset does not affect the operation of the
SRAM and may be performed while the SRAM is operating. At
power up, the TAP is reset internally to ensure that TDO
comes up in a High-Z state.
TAP Registers
Registers are connected between the TDI and TDO balls and
allow data to be scanned in and out of the SRAM test circuitry.
Only one register can be selected at a time through the
instruction registers. Data is serially loaded into the TDI ball on
the rising edge of TCK. Data is output on the TDO ball on the
falling edge of TCK.
Instruction Register
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the
TDI and TDO balls as shown in the
Diagram. Upon power up, the instruction register is loaded
with the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as
described in the previous section.
When the TAP controller is in the Capture-IR state, the two
least significant bits are loaded with a binary ‘01’ pattern to
allow for fault isolation of the board level serial test path.
TMS
TCK
TDI
Selection
Circuitry
CY7C1381D, CY7C1381F
CY7C1383D, CY7C1383F
Boundary Scan Register
Identification Register
31
x
Instruction Register
TAP CONTROLLER
30
.
Bypass Register
29
.
TAP Controller State
.
.
.
.
.
.
2
2
2
1
1
1
0
0
0
0
TAP Controller Block
TAP Controller Block
S
Circuitr
election
DD
Page 11 of 29
) for five rising
y
Diagram.)
TDO
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