NAND04GW3B2DN6E NUMONYX, NAND04GW3B2DN6E Datasheet - Page 70

• Manufacturer Part Number: NAND04GW3B2DN6E
• Description: IC FLASH 4GBIT 48TSOP
• Manufacturer: NUMONYX

Specifications of NAND04GW3B2DN6E

• Format - Memory: FLASH
• Memory Type: FLASH - Nand
• Memory Size: 4G (512M x 8)
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Speed: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision history
15
70/72
Revision history
Table 35.
22-June-2007
07-May-2008
17-Sep-2007
10-Dec-2007
11-Mar-2009
23-Apr-2008
15-Jun-2009
Date
Document revision history
Revision
1
2
3
4
5
6
7
Initial release.
Added the part numbers NAND08GR3B4C, NAND08GW3B4C,
therefore referring to the 8-Gbit devices as the NAND08G-BxC.
Modified all data throughout this document to reflect the addition
of these part numbers, namely:
–
– Added
Changed VLKO value in
Applied Numonyx branding.
Modified:
Multiplane page program
back
Read status enhanced
enable
and
ready/busy
Multiplane page
Section 6.8: Multiplane block erase
ONFI
erase endurance cycles
measurement
Added ECOPACK text in
Removed ‘or ECC’ from Program failure in
failure.
Minor text changes.
Document status promoted from preliminary data to datasheet.
Modified
Added security features on the cover page and in
Description. Modified
Figure 42: Resistor value versus waveform timings for
ready/busy
References to ECOPACK packages removed and replaced by
references to RoHS compliance throughout the document.
Modified
package
Table
devices.
Figure 42: Resistor value versus waveform timings for
program,
signature,
waveform,
1,
outline. Minor text changes.
: Bad blocks
Figure 45: ULGA52 12 x 17 x 0.65 mm, 1 mm pitch,
Figure 5: ULGA52 connections for the NAND08G-B4C
Figure 6: Memory array
Table
signal,
signal.
conditions.
Figure 19: Multiplane block
2,
program,
Table 24: Program erase times and program
Figure 38: Program/erase disable
Section 6.2: Cache
Table
Figure 40: Ready/busy AC waveform
in
waveform,
and
Section 2: Memory array
Table 28
6, and
Section 13: Package
waveform,
Section 6.5: Copy back
Changes
NAND04G-B2D, NAND08G-BxC
Table 26: Operating and AC
Table
from 1.1 to 1.2.
organization,
Figure 37: Program/erase
and
Figure 17: Multiplane copy
34.
read,
Section 6.15: Read
erase,
Table 23: Block
Section 6.4:
mechanical.
Figure 13:
Figure 30:
organization.
Section 1:
program,
waveform,
and