ESDALC6-4N4 STMicroelectronics, ESDALC6-4N4 Datasheet - Page 9

• Manufacturer Part Number: ESDALC6-4N4
• Description: TVS Diode Arrays 7V 9.5pF ESD Array 70nA 4-Lines 6V
• Manufacturer: STMicroelectronics
• Series: ESDr

Specifications of ESDALC6-4N4

• Rohs: yes
• Polarity: Unidirectional
• Channels: 4 Channels
• Breakdown Voltage: 6 V
• Clamping Voltage: 10 V
• Peak Surge Current: 2.3 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Minimum Operating Temperature: + 25 C
• Maximum Operating Temperature: + 25 C
• Capacitance: 9.5 pF
• Case Height: 0.38 mm
• Package / Case: uQFN-4L
• Peak Pulse Power Dissipation: 27 W

ESDALC6-4N4
4.4
4.5
Note:
4.
5.
6.
PCB design preference
1.
2.
Reflow profile
Figure 18. ST ECOPACK
Minimize air convection currents in the reflow oven to avoid component movement.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
250
200
150
100
50
0
Temperature (°C)
30
0.9 °C/s
®
60
recommended soldering reflow profile for PCB mounting
Doc ID 022191 Rev 2
90
120
2 - 3 °C/s
150
240-245 °C
180
(90 max)
Recommendation on PCB assembly
60 sec
210
240
Time (s)
-3 °C/s
270
-2 °C/s
-6 °C/s
300
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