IS42S32800D-7TL ISSI, Integrated Silicon Solution Inc, IS42S32800D-7TL Datasheet - Page 2
![IC SDRAM 256MBIT 143MHZ 86TSOP](/photos/7/23/72332/is42s32800d-7tl_sml.jpg)
IS42S32800D-7TL
Manufacturer Part Number
IS42S32800D-7TL
Description
IC SDRAM 256MBIT 143MHZ 86TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Specifications of IS42S32800D-7TL
Format - Memory
RAM
Memory Type
SDRAM
Memory Size
256M (8Mx32)
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
86-TSOPII
Organization
8Mx32
Density
256Mb
Address Bus
13b
Access Time (max)
6.5/5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
150mA
Pin Count
86
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
706-1084
IS42S32800D-7TL
IS42S32800D-7TL
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IS42S32800D-7TL
Manufacturer:
TRACO
Quantity:
101
Part Number:
IS42S32800D-7TL
Manufacturer:
ISSI
Quantity:
20 000
Part Number:
IS42S32800D-7TLI
Manufacturer:
ISSI
Quantity:
20 000
data at a high data rate with automatic column-address
generation, the ability to interleave between internal banks
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during
burst access.
IS42S32800D, IS45S32800D
DEVICE OVERVIEW
The 256Mb SDRAM is a high speed CMOS, dynamic
random-access memory designed to operate in 3.3V V
and 3.3V V
bits. Internally configured as a quad-bank DRAM with a
synchronous interface. Each 67,108,864-bit bank is orga-
nized as 4,096 rows by 512 columns by 32 bits.
The 256Mb SDRAM includes an AUTO REFRESH MODE,
and a power-saving, power-down mode. All signals are
registered on the positive edge of the clock signal, CLK.
All inputs and outputs are LVTTL compatible.
The 256Mb SDRAM has the ability to synchronously burst
FUNCTIONAL BLOCK DIAGRAM (FOR 2M
2
CKE
RAS
CAS
A10
CLK
BA0
BA1
A11
WE
CS
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
ddq
memory systems containing 268,435,456
GENERATOR
COMMAND
DECODER
12
CLOCK
&
ADDRESS
LATCH
ROW
9
ADDRESS BUFFER
BURST COUNTER
ADDRESS LATCH
REGISTER
MODE
COLUMN
COLUMN
12
12
CONTROLLER
COUNTER
REFRESH
REFRESH
CONTROLLER
REFRESH
ADDRESS
BUFFER
x
dd
SELF
ROW
32
x
4 BANKS)
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE function
enabled. Precharge one bank while accessing one of the
other three banks will hide the precharge cycles and provide
seamless, high-speed, random-access operation.
SDRAM read and write accesses are burst oriented starting
at a selected location and continuing for a programmed
number of locations in a programmed sequence. The
registration of an ACTIVE command begins accesses,
followed by a READ or WRITE command. The ACTIVE
command in conjunction with address bits registered are
used to select the bank and row to be accessed (BA0,
BA1 select the bank; A0-A11 select the row). The READ
or WRITE commands in conjunction with address bits
registered are used to select the starting column location
for the burst access.
Programmable READ or WRITE burst lengths consist of
1, 2, 4 and 8 locations or full page, with a burst terminate
option.
BANK CONTROL LOGIC
12
Integrated Silicon Solution, Inc. - www.issi.com
4096
32
32
4096
4096
4096
DATA OUT
BUFFER
BUFFER
9
DATA IN
(x 32)
COLUMN DECODER
512
SENSE AMP I/O GATE
MEMORY CELL
BANK 0
32
32
ARRAY
4
DQM0 - DQM3
DQ 0-31
V
V
DD
ss
/V
/V
ss
DDQ
Q
12/01/09
Rev. C