IS43R16160B-6TL ISSI, Integrated Silicon Solution Inc, IS43R16160B-6TL Datasheet - Page 39

• Manufacturer Part Number: IS43R16160B-6TL
• Description: IC DDR SDRAM 256MBIT 66TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS43R16160B-6TL

• Package / Case: 66-TSOPII
• Memory Size: 256M (16Mx16)
• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 167 MHz
• Access Time: 0.7 ns
• Supply Voltage (max): 2.7 V
• Supply Voltage (min): 2.3 V
• Maximum Operating Current: 250 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 706-1086; IS43R16160B-6TL

Plastic TSOP 66-pin
Package Code: T (Type II)
IS43R83200B
IS43R16160B, IC43R16160B
Integrated Silicon Solution, Inc.
Rev. B
10/31/08
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
A
C
D
E
b
e
L
e
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.03 10.29
11.56 11.96
—
—
—
0.71 REF
0.05
0.24
0.12
0.40
0°
0.65 BSC
—
—
Max
1.20
0.15
0.40
0.21
0.60
8°
66
D
—
—
—
Min
0.002 0.006
0.009 0.016
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.026 BSC
0.016 0.024
0.028 REF
0°
Inches
—
—
Max
0.047
8°
N/2+1
b
N/2
E1
A
A1
E
SEATING PLANE
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
.
should be
C
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