IS43R16160B-6TL ISSI, Integrated Silicon Solution Inc, IS43R16160B-6TL Datasheet - Page 36

• Manufacturer Part Number: IS43R16160B-6TL
• Description: IC DDR SDRAM 256MBIT 66TSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS43R16160B-6TL

• Package / Case: 66-TSOPII
• Memory Size: 256M (16Mx16)
• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 167 MHz
• Access Time: 0.7 ns
• Supply Voltage (max): 2.7 V
• Supply Voltage (min): 2.3 V
• Maximum Operating Current: 250 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 706-1086; IS43R16160B-6TL

IS43R83200B
IS43R16160B, IC43R16160B
36
[SELF REFRESH]
Self -refresh mode is entered by issuing a REFS command (/CS=/RAS=/CAS=L,/WE=H,CKE=L).
Once the self-refresh is initiated, it is maintained as long as CKE is kept low. During the self-
refresh mode, CKE is asynchronous and the only enable input, all other inputs including CLK are
disabled and ignored, so that power consumption due to synchronous inputs is saved. To exit the
self-refresh, supplying stable CLK inputs, asserting DESEL or NOP command and then asserting
CKE for longer than tXSNR/tXSRD.
A0-12
BA0,1
/CLK
/RAS
/CAS
CKE
CLK
/WE
/CS
Self Refresh Exit
Self-Refresh
tXSNR
X
X
tXSRD
Integrated Silicon Solution, Inc.
Y
Y
10/31/08
Rev. B