P5010NXE1QMB Freescale Semiconductor, P5010NXE1QMB Datasheet - Page 158

• Manufacturer Part Number: P5010NXE1QMB
• Description: Processors - Application Specialized P5010 Ext TmpEnc 1600/1200 r2.0
• Manufacturer: Freescale Semiconductor

Specifications of P5010NXE1QMB

• Rohs: yes

Package Information
This figure depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is conducted through the
silicon and through the heat sink attach material (or thermal interface material), and finally to the heat sink. The junction-to-case
thermal resistance is low enough that the heat sink attach material and heat sink thermal resistance are the dominant terms.
3.8.2
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal contact resistance. The
performance of thermal interface materials improves with increasing contact pressure; this performance characteristic chart is
generally provided by the thermal interface vendor. The recommended method of mounting heat sinks on the package is by
means of a spring clip attachment to the printed-circuit board (see
The system board designer can choose among several types of commercially-available thermal interface materials.
3.8.3
The chip has a temperature diode on the microprocessor that can be used in conjunction with other system temperature
monitoring devices (such as Analog Devices, ADT7461A™). These devices use the negative temperature coefficient of a diode
operated at a constant current to determine the temperature of the microprocessor and its environment.
The following are the specifications of the chip’s on-board temperature diode:
4
The following section describes the detailed content and mechanical description of the package.
4.1
The package parameters are as provided in the following list. The package type is 37.5 mm × 37.5 mm, 1295 flip chip plastic
ball grid array (FC-PBGA).
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Operating range: 10 – 230µA
Ideality factor over 13.5 – 220 µA: n = 1.00569 ± 0.008
Package Information
Package Parameters for the FC-PBGA
Thermal Interface Materials
Temperature Diode
(Note the internal versus external package resistance)
External Resistance
External Resistance
Internal Resistance
Figure 66. Package with Heat Sink Mounted to a Printed-Circuit Board
P5020/P5010 QorIQ Integrated Processor Hardware Specifications, Rev. 0
Printed-Circuit Board
Junction to lid top
Heat Sink
Radiation
Radiation
Figure
Convection
Convection
65).
Thermal Interface Material
Junction to case top
Die/Package
Die Junction
Package/Solder balls
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