MR25H40MDF Everspin Technologies, MR25H40MDF Datasheet - Page 9

• Manufacturer Part Number: MR25H40MDF
• Description: NVRAM 4Mb 3.3V 512Kx8 SPI Pre-Qual Sample MRAM
• Manufacturer: Everspin Technologies

Specifications of MR25H40MDF

• Rohs: yes
• Data Bus Width: 8 bit
• Memory Size: 4 MB
• Organization: 512 K x 8
• Interface Type: SPI
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 3 V
• Operating Current: 20 mA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Package / Case: DFN-8
• Maximum Power Dissipation: 0.6 W
• Operating Temperature Range: - 40 C to + 125 C
• Operating Voltage: 3 V to 3.6 V

Enter Sleep Mode (SLEEP)
The Enter Sleep Mode (SLEEP) command turns off all MRAM power regulators in order to reduce the overall
chip standby power to 15 μA typical. The SLEEP command is entered by driving CS low, sending the com-
mand code, and then driving CS high. The standby current is achieved after time, t
when the part is in sleep mode, upon power restoration, the part enters normal standby. The only valid
command following SLEEP mode entry is a WAKE command.
Exit Sleep Mode (WAKE)
The Exit Sleep Mode (WAKE) command turns on internal MRAM power regulators to allow normal operation.
The WAKE command is entered by driving CS low, sending the command code, and then driving CS high.
The memory returns to standby mode after t
WAKE must be executed after sleep mode entry and prior to any other command.
Everspin Technologies © 2011
SPI COMMUNICATIONS PROTOCOL
SCK
CS
SCK
SO
CS
SI
SO
SI
1
1
0
0
0
0
1
1
1
1
2
2
Active Current
Instruction (ABh)
Instruction (B9h)
0
1
3
3
Sleep Mode Current
1
1
4
4
RDP
Figure 2.7 SLEEP
Figure 2.8 WAKE
. The CS pin must remain high until the t
0
0
5
5
0
1
9
6
6
1
1
7
7
Standby Current
t
t
RDP
DP
DP
MR25H40 Rev. 5, 11/2011
. If power is removed
Sleep Mode Current
MR25H40
RDP
Standby Current
period is over.
Mode 3
Mode 0
Mode 3
Mode 0