MR25H40MDF Everspin Technologies, MR25H40MDF Datasheet - Page 19

• Manufacturer Part Number: MR25H40MDF
• Description: NVRAM 4Mb 3.3V 512Kx8 SPI Pre-Qual Sample MRAM
• Manufacturer: Everspin Technologies

Specifications of MR25H40MDF

• Rohs: yes
• Data Bus Width: 8 bit
• Memory Size: 4 MB
• Organization: 512 K x 8
• Interface Type: SPI
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 3 V
• Operating Current: 20 mA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Package / Case: DFN-8
• Maximum Power Dissipation: 0.6 W
• Operating Temperature Range: - 40 C to + 125 C
• Operating Voltage: 3 V to 3.6 V

Everspin Technologies © 2011
7. REVISION HISTORY
Revision
0
0 .1
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2
3
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5
Contact Information:
How to Reach Us:
Home Page:
www.everspin.com
E-Mail:
[e-mail]
[e-mail]
[e-mail]
USA/Canada/South and Central America
Everspin Technologies
1347 N. Alma School Road, Suite 220
Chandler, Arizona 85224
+1-877-347-MRAM (6726)
[phone]
Europe, Middle East and Africa
[e-mail]
Japan
[e-mail]
Asia Pacific
[e-mail]
Date
Jan 15, 2010
Feb. 23, 2010
May 5, 2010
Jan 11, 2011
Apr 25, 2011
September 22,
2011
Nov 18, 2011
Description of Change
Product Concept Release
Fixed typos in text.
Removed commercial specifications. All parts meet industrial specifications.
Preliminary Product Release. Updated description of status register non-volatility, WAKE
command, Table 3.4.
Removed DIP package part to seperate datasheet. Added inset detail for mechanical pack-
age drawings.
Added AEC-Q100 Grade 1 ordering option. Revised Table 3.1, Table 3.2, Table 3.4, Table 4.4
revised and Note 2 deleted, revised Figure 5.1 and Table 5.1.
Corrected V
New Small Flag DFN package option added to Page 1 Features and available parts Table 5.1.
DFN Small Flag drawing and dimensions table added as Figure 6.2. Figure 6.1, DFN Pack-
age, cleaned up with better quality drawing and dimension table. No specifications were
changed in Figure 6.1.
OL
in Table 3.3 to read V
Information in this document is provided solely to enable system and software implementers to use
Everspin Technologies products. There are no express or implied licenses granted hereunder to design or
fabricate any integrated circuit or circuits based on the information in this document. Everspin Technolo-
gies reserves the right to make changes without further notice to any products herein. Everspin makes no
warranty, representation or guarantee regarding the suitability of its products for any particular purpose,
nor does Everspin Technologies assume any liability arising out of the application or use of any product or
circuit, and specifically disclaims any and all liability, including without limitation consequential or inci-
dental damages. “Typical” parameters, which may be provided in Everspin Technologies data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters including “Typicals” must be validated for each customer application by customer’s
technical experts. Everspin Technologies does not convey any license under its patent rights nor the rights
of others. Everspin Technologies products are not designed, intended, or authorized for use as compo-
nents in systems intended for surgical implant into the body, or other applications intended to support
or sustain life, or for any other application in which the failure of the Everspin Technologies product
could create a situation where personal injury or death may occur. Should Buyer purchase or use Everspin
Technologies products for any such unintended or unauthorized application, Buyer shall indemnify and
hold Everspin Technologies and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized use,
even if such claim alleges that Everspin Technologies was negligent regarding the design or manufacture
of the part. Everspin™ and the Everspin logo are trademarks of Everspin Technologies, Inc. All other
product or service names are the property of their respective owners.
©Everspin Technologies, Inc. 2011
19
OL
Max = V
SS
+ 0.2v. Corrected SI waveform in Figure 2.8.
MR25H40 Rev. 5, 11/2011
MR25H40