KPC8544EVTANG Freescale Semiconductor, KPC8544EVTANG Datasheet - Page 103

• Manufacturer Part Number: KPC8544EVTANG
• Description: Microprocessors - MPU PQ38K 8544E
• Manufacturer: Freescale Semiconductor

Specifications of KPC8544EVTANG

• Product Category: Microprocessors - MPU
• Rohs: yes
• Maximum Clock Frequency: 800 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Package / Case: FCPBGA
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Factory Pack Quantity: 5

20.3.3
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where
During operation the die-junction temperatures (T
Table
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
may range from 30° to 40° C. The air temperature rise within a cabinet (T
10° C. The thermal resistance of the thermal interface material (θ
T
expression for T
The heat sink-to-ambient thermal resistance (θ
#2328B is shown in
Assuming an air velocity of 1 m/s, we have an effective θ
resulting in a die-junction temperature of approximately 66, which is well within the maximum operating
temperature of the component.
Freescale Semiconductor
I
of 30° C, a T
2. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Thermagon Inc. 888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
T
T
T
θ
θ
θ
P
JC
INT
SA
D
J
I
R
is the die-junction temperature
is the inlet cabinet ambient temperature
is the power dissipated by the device
is the air temperature rise within the computer cabinet
is the junction-to-case thermal resistance
is the heat sink base-to-ambient thermal resistance
Heat Sink Selection Examples
is the adhesive or interface material thermal resistance
T
Die-junction temperature: T
T
R
J
J
J
MPC8544E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
of 5° C, a FC-PBGA package θ
= T
= 30° + 5° C + (0.1° C/W + 1.0° C/W + 5° C/W) × 5
is obtained:
Figure
I
+ T
R
+ (θ
64.
JC
+ θ
INT
+ θ
J
= 30° C + 5° C + (0.1° C/W + 1.0° C/W + θ
SA
SA
JC
) × P
) versus airflow velocity for a Thermalloy heat sink
= 0.1, and a power consumption (P
J
) should be maintained within the range specified in
D
SA+
of about 5° C/W, thus
INT
) may be about 1° C/W. Assuming a
R
) may be in the range of 5° to
D
) of 5, the following
SA
) × P
D
Thermal
103
I
)