SPC5646CCF0MLT1 Freescale Semiconductor, SPC5646CCF0MLT1 Datasheet - Page 59

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SPC5646CCF0MLT1

Manufacturer Part Number
SPC5646CCF0MLT1
Description
32-bit Microcontrollers - MCU 3M FLASH,25 6K RAM,CSE
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of SPC5646CCF0MLT1

Rohs
yes
Core
e200
Processor Series
MPC5646C
Data Bus Width
32 bit
Maximum Clock Frequency
120 MHz
Program Memory Size
3 MB
Data Ram Size
256 KB
On-chip Adc
Yes
Operating Supply Voltage
0.3 V to 6.2 V
Operating Temperature Range
- 40 C to + 125 C
Package / Case
LQFP-208
Mounting Style
SMD/SMT
A/d Bit Size
10 bit, 12 bit
A/d Channels Available
33
Interface Type
CAN, I2C, SCI, SPI
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
177
Number Of Timers
32
Program Memory Type
Flash
Supply Voltage - Max
6.2 V
Supply Voltage - Min
0.3 V
4.10
4.10.1
Table 25
Freescale
9
10
11
12
13
14
15
1
2
3
4
5
T
T
T
Subject to change, Configuration: 1
1
3
1
channels. RUN current measured with typical application with accesses on both code flash and RAM.
This value is obtained from limited sample set
Data Flash Power Down. Code Flash in Low Power. SIRC 128 kHz and FIRC 16 MHz ON. 16 MHz XTAL clock.
FlexCAN: instances: 0, 1, 2 ON (clocked but no reception or transmission), instances: 4, 5, 6 clocks gated. LINFlex:
instances: 0, 1, 2 ON (clocked but no reception or transmission), instance: 3-9 clocks gated. eMIOS: instance: 0 ON
(16 channels on PA[0]-PA[11] and PC[12]-PC[15]) with PWM 20 kHz, instance: 1 clock gated. DSPI: instance: 0
(clocked but no communication, instance: 1-7 clocks gated). RTC/API ON. PIT ON. STM ON. ADC ON but no
conversion except 2 analog watchdogs.
Only for the “P” classification: No clock, FIRC 16 MHz OFF, SIRC128 kHz ON, PLL OFF, HPvreg OFF, LPVreg ON.
All possible peripherals off and clock gated. Flash in power down mode.
Only for the “P” classification: LPreg ON, HPVreg OFF, 96 KB RAM ON, device configured for minimum consumption,
all possible modules switched-off.
Only for the “P” classification: LPreg ON, HPVreg OFF, 64 KB RAM ON, device configured for minimum consumption,
all possible modules switched-off.
LPreg ON, HPVreg OFF, 8 KB RAM ON, device configured for minimum consumption, all possible modules switched
OFF.
T
128Kpperase
16Kpperase
32Kpperase
Typical program and erase times assume nominal supply values and operation at 25 °C. All times are subject to
change pending device characterization.
Initial factory condition: < 100 program/erase cycles, 25 °C, typical supply voltage.
The maximum program and erase times occur after the specified number of program/erase cycles. These maximum
values are characterized but not guaranteed.
Actual hardware programming times. This does not include software overhead.
It is Time between erase suspend resume and the next erase suspend request.
dwprogram
 e
t
shows the code flash memory program and erase characteristics.
ESRT
t
t
T
PABT
EAPT
Symbol
4 Mbit/s, 1
RTC, 4 PIT channels, 1
eslat
Flash memory electrical characteristics
DMA (10 ch.), 6
5
Program/Erase characteristics
CC
10 Mbit/s), 16
C
C
D Erase Suspend Latency
C Erase Suspend Request Rate
D Program Abort Latency
D Erase Abort Latency
Table 25. Code flash memory—Program and erase specifications
Double word (64 bits) program time
16 KB block pre-program and erase time
32 KB block pre-program and erase time
128 KB block pre-program and erase time
FlexCAN (4
SWT, 1
MPC5646C Microcontroller DataSheet, Rev. 5.1
Timed I/O, 16
Parameter
500 kbit/s, 2
e200z4d + 4 kbit/s Cache, 1
STM. For lower pin count packages reduce the amount of timed I/O’s and ADC
ADC Input, 1
125 kbit/s), 4
4
FlexRay (2 ch., 10 Mbit/s), 1
Min
LINFlexD (20 kbit/s), 6
20
e200z0h (1/2 system frequency), CSE,
Typ
200
300
600
18
1
Value
Initial
max
1300
500
600
50
30
10
30
DSPI (2
Electrical Characteristics
2
FEC (100 Mbit/s),
Max
5000
5000
5000
500
30
10
30
2 Mbit/s,
3
Unit
ms
ms
ms
ms
µs
µs
µs
µs
59

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