SSTU32865ET,557 NXP Semiconductors, SSTU32865ET,557 Datasheet - Page 2

• Manufacturer Part Number: SSTU32865ET,557
• Description: IC BUFFER 1.8V 28BIT SOT802-1
• Manufacturer: NXP Semiconductors

Specifications of SSTU32865ET,557

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Logic Family: SSTU
• Logical Function: Reg Bfr W/ParityTst
• Number Of Elements: 1
• Number Of Inputs: 28
• Number Of Outputs: 56
• High Level Output Current: -8mA
• Low Level Output Current: 8mA
• Propagation Delay Time: 3ns
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Clock-edge Trigger Type: Posit/Negat-Edge
• Polarity: Non-Inverting
• Technology: CMOS
• Frequency (max): 450(Min)MHz
• Mounting: Surface Mount
• Pin Count: 160
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935275069557; SSTU32865ET; SSTU32865ET

Philips Semiconductors
3. Applications
4. Ordering information
Table 1:
9397 750 13799
Product data sheet
Type number
SSTU32865ET/G
SSTU32865ET
Ordering information
Solder process
Pb-free (SnAgCu solder ball
compound)
SnPb solder ball compound
High-density (e.g. 2 rank by 4) DDR2 registered DIMMs
DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
Rev. 02 — 28 September 2004
Package
Name
TFBGA160
TFBGA160
Description
plastic thin fine-pitch ball grid array package;
160 balls; body 9
plastic thin fine-pitch ball grid array package;
160 balls; body 9
1.8 V DDR registered buffer with parity
13
13
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
0.8 mm
0.8 mm
SSTU32865
Version
SOT802-1
SOT802-1
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