STM8S003F3P6TR STMicroelectronics, STM8S003F3P6TR Datasheet - Page 94

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STM8S003F3P6TR

Manufacturer Part Number
STM8S003F3P6TR
Description
STM8 Series 8-bit 8 KB Flash 1 KB RAM 16 MHz Microcontroller - TSSOP-20
Manufacturer
STMicroelectronics
Datasheet

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Thermal characteristics
11
11.1
11.2
94/100
Thermal characteristics
The maximum chip junction temperature (T
Operating
The maximum chip-junction temperature, T
the following equation:
T
Where:
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural convection
(still air). Available from www.jedec.org.
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the order code.
Symbol
Θ
Θ
Θ
(1)
convection environment.
Jmax
JA
JA
JA
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
T
Θ
P
P
power.
P
Where: P
V
Amax
Dmax
INTmax
I/Omax
OH
JA
= T
/I
is the package junction-to-ambient thermal resistance in °C/W
OH
Amax
is the maximum ambient temperature in °C
is the sum of P
conditions.
represents the maximum power dissipation on output pins
is the product of I
of the I/Os at low and high level in the application.
I/Omax
+ (P
Parameter
Thermal resistance junction-ambient
TSSOP20 - 4.4 mm
Thermal resistance junction-ambient
UFQFPN20 - 3 x 3 mm
Thermal resistance junction-ambient
LQFP32 - 7 x 7 mm
=Σ (V
Dmax
x Θ
OL
INTmax
*I
(1)
JA
DD
OL
Table 54: Thermal characteristics
)
) + Σ((V
DocID018576 Rev 3
andV
and P
DD
I/Omax
DD
, expressed in Watts. This is the maximum chip internal
-V
OH
Jmax
J max
(PDmax = P
)*I
, in degrees Celsius, may be calculated using
OH
) must never exceed the values given in
), taking into account the actual V
INTmax
+ P
STM8S003K3 STM8S003F3
Value
I/Omax
84
90
60
)
Unit
OL
°C/W
/I
OL and

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