ESDALC6V1-1BM2_08 STMICROELECTRONICS [STMicroelectronics], ESDALC6V1-1BM2_08 Datasheet - Page 7

• Manufacturer Part Number: ESDALC6V1-1BM2_08
• Description: Single line low capacitance Transil for ESD protection
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

ESDALC6V1-1BM2
4
4.1
4.2
Recommendation on PCB assembly
Stencil opening design
1.
Figure 14. Stencil opening dimensions
2.
Figure 15. Recommended stencil windows position
Solder paste
1.
2.
3.
4.
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed
Solder paste with fine particles: powder particle size is 20-45 µm.
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for leads: Opening to footprint ratio - between 60% and 65%.
Aspect Ratio
Aspect Area
Lead footprint on PCB
Stencil window
position
0.45 mm
=
=
W
---- -
--------------------------- -
2T L
T
L
1.5
0.39 mm
+
W
W
0.05 mm
Package footprint
L
0.66
T
W
Recommendation on PCB assembly
0.05 mm
Lead footprint on PCB
Stencil window
position
7/10