KMM5362205C2W SAMSUNG [Samsung semiconductor], KMM5362205C2W Datasheet - Page 17
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KMM5362205C2W
Manufacturer Part Number
KMM5362205C2W
Description
2M x 36 DRAM SIMM using 1Mx16 and 4M Quad CAS EDO, 1K Refresh
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.KMM5362205C2W.pdf
(17 pages)
DRAM MODULE
PACKAGE DIMENSIONS
Tolerances : .005(.13) unless otherwise specified
NOTE : The used device are 1Mx16 EDO DRAM and 1Mx4 Quad CAS with EDO DRAM.
DRAM Part No. : KMM5362205C2W/C2WG -- KM416C1204CJ (400 mil)
Revision History
Rev 0.0 : Nov. 1997
.750(19.05)
.250(6.35)
.133(3.38)
.010(.25)MAX
.080(2.03)
.250(6.35)
Gold & Solder Plating Lead
.050(1.27)
-- KM44C1005DJ (300 mil)
R.062(1.57)
.041 .004(1.04 .10)
.100(2.54)
.250(6.35)
MIN
( Front view )
4.250(107.95)
3.984(101.19)
( Back view )
3.750(95.25)
- 17 -
.125 DIA .002(3.18 .051)
R.062 .004(R1.57 .10)
.054(1.37)
.047(1.19)
KMM5362205C2W/C2WG
.350(8.89)
MAX
.225(5.71)
MIN
.125(3.17)
Rev. 0.0 (Nov. 1997)
Units : Inches (millimeters)
MIN
.400(10.16)