HFCT-5964ATG NEL [Nel Frequency Controls,inc], HFCT-5964ATG Datasheet - Page 4

• Manufacturer Part Number: HFCT-5964ATG
• Description: ATG Single Mode Laser Small Form Factor Transceivers for ATM, SONET OC-3 /SDH STM-1 Part of the Agilent METRAK family
• Manufacturer: NEL [Nel Frequency Controls,inc]

Package
The overall package concept for
these devices consists of the
following basic elements; two
optical subassemblies, two
electrical subassemblies and the
housing as illustrated in the
block diagram in Figure 3.
The package outline drawing
and pin out are shown in
Figures 4 and 5. The details of
this package outline and pin out
are compliant with the multi-
source definition of the 2 x 10
DIP. The low profile of the
Agilent transceiver design
complies with the maximum
height allowed for the LC
connector over the entire length
of the package.
Figure 3. Block Diagram
4
DATA OUT
NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
DATA OUT
SIGNAL
DATA IN
DATA IN
Tx DISABLE
DETECT
AND CONTROL
LASER DRIVER
T
X
CIRCUIT
GROUND
QUANTIZER IC
The electrical subassemblies
consist of high volume
multilayer printed circuit boards
on which the IC and various
surface-mounted passive circuit
elements are attached.
The receiver electrical
subassembly includes an
internal shield for the electrical
and optical subassembly to
ensure high immunity to
external EMI fields.
The optical subassemblies are
each attached to their respective
transmit or receive electrical
subassemblies. These two units
are then fitted within the outer
housing of the transceiver that is
molded of filled nonconductive
plastic to provide mechanical
strength. The housing is then
R
T
X
X
SUPPLY
SUPPLY
R
X
MONITORING
LASER DIODE
MODULATOR
LASER BIAS
GROUND
CASE
encased with a metal EMI
protective shield. The case is
connected to signal ground and
we recommend soldering the
four ground tabs to host card
signal ground.
The PCBs for the two electrical
subassemblies both carry the
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into
the molding of the device and
are designed to provide the
mechanical strength required to
withstand the loads imposed on
the transceiver by mating with
the LC connectored fiber cables.
Although they are not connected
electrically to the transceiver, it
is recommended to connect
them to chassis ground.
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
NOTE
LC
RECEPTACLE