K4T51043QG SAMSUNG [Samsung semiconductor], K4T51043QG Datasheet - Page 2

• Manufacturer Part Number: K4T51043QG
• Description: 512Mb G-die DDR2 SDRAM Specification
• Manufacturer: SAMSUNG [Samsung semiconductor]

K4T51043QG
K4T51083QG
K4T51163QG
Table of Contents
1.0 Ordering Information ....................................................................................................................4
2.0 Key Features .................................................................................................................................4
3.0 Package Pinout/Mechanical Dimension & Addressing .............................................................5
4.0 Input/Output Functional Description ........................................................................................10
5.0 DDR2 SDRAM Addressing .........................................................................................................11
6.0 Absolute Maximum DC Ratings .................................................................................................12
7.0 AC & DC Operating Conditions .................................................................................................12
8.0 ODT DC electrical characteristics .............................................................................................14
9.0 OCD default characteristics ......................................................................................................15
10.0 IDD Specification Parameters and Test Conditions ..............................................................16
11.0 DDR2 SDRAM IDD Spec ...........................................................................................................18
12.0 Input/Output capacitance .........................................................................................................19
13.0 Electrical Characteristics & AC Timing for DDR2-800/667/533/400 ......................................19
14.0 General notes, which may apply for all AC parameters ........................................................24
15.0 Specific Notes for dedicated AC parameters .........................................................................26
3.1 x4 package pinout (Top View) : 60ball FBGA Package
3.2 x8 package pinout (Top View) : 60ball FBGA Package
3.3 x16 package pinout (Top View) : 84ball FBGA Package
3.4 FBGA Package Dimension(x4/ x8)
3.5 FBGA Package Dimension(x16)
7.1 Recommended DC Operating Conditions (SSTL - 1.8)
7.2 Operating Temperature Condition
7.3 Input DC Logic Level
7.4 Input AC Logic Level
7.5 AC Input Test Conditions
7.6 Differential input AC logic Level
7.7 Differential AC output parameters
13.1 Refresh Parameters by Device Density
13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin
13.3 Timing parameters by speed grade (DDR2-800 and DDR2-667)
13.4 Timing parameters by speed grade (DDR2-533 and DDR2-400)
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Rev. 1.4 December 2008
DDR2 SDRAM