OR3T125 Agere Systems, OR3T125 Datasheet - Page 202

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OR3T125

Manufacturer Part Number
OR3T125
Description
3C and 3T Field-Programmable Gate Arrays
Manufacturer
Agere Systems
Datasheet

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ORCA Series 3C and 3T FPGAs
Package Outline Diagrams
256-Pin PBGA
Dimensions are in millimeters.
202
Note: Although the 16 thermal enhancement balls are stated as an option, they are standard on the 256 FPGA package.
(SEE NOTE BELOW)
CENTER ARRAY
ENHANCEMENT
IDENTIFIER ZONE
FOR THERMAL
(OPTIONAL)
COMPOUND
CORNER
A1 BALL
A1 BALL
MOLD
PWB
0.60
0.36
W
M
G
Y
V
U
T
R
P
N
K
H
F
E
D
C
B
A
L
J
(continued)
0.10
1 2 3 4 5 6 7 8 9 10
0.04
19 SPACES @ 1.27 = 24.13
27.00
24.00
11
+0.70
–0.00
0.20
12
13
SOLDER BALL
14
15
16
17
1.17
18
19
20
0.05
24.00
0.75
@ 1.27 = 24.13
19 SPACES
+0.70
–0.00
0.15
Lucent Technologies Inc.
2.13
27.00
SEATING PLANE
0.20
0.19
Data Sheet
0.20
June 1999
5-4406(F)

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