PA2423G-EV SiGe Semiconductor Inc., PA2423G-EV Datasheet - Page 4

• Manufacturer Part Number: PA2423G-EV
• Description: 2.4 GHz Bluetooth Class 1 Power Amplifier IC Preliminary Information
• Manufacturer: SiGe Semiconductor Inc.

Gold Bump Bare Die - Top and Side Views
The first drawing provides the top view of the gold bump bare die (gold bumps on top surface). This view
should be used for the chip-on-board mounting. The second drawing illustrates the side view of the die.
630µm±20µm
DOC # 05PDS003 Rev 5
300 µ m ± 5 µ m
(X=0,Y=0)
25 µ m ± 3 µ m
142 µ m
1
±10 µ m
100
100
45
o
±0 µ m
±0 µ m
2
12
60±0 µ m
60±0 µ m
100±0 µ m
SILICON
3
11
960 µ m ± 20 µ m
60±0 µ m
60±0 µ m
07/26/2001
460±0 µ m
2.4 GHz Bluetooth Class 1 Power Amplifier IC
4
10
60±0 µ m
60±0 µ m
100
100
5
9
±0 µ m
±0 µ m
60±0 µ m
60±0 µ m
6
8
Preliminary Information
Gold
7
65µm±10µm
PA2423G
Page 4