MCF5329DS ANALOGICTECH [Advanced Analogic Technologies], MCF5329DS Datasheet - Page 12

• Manufacturer Part Number: MCF5329DS
• Description: MCF5329 ColdFire Microprocessor Data Sheet
• Manufacturer: ANALOGICTECH [Advanced Analogic Technologies]

Mechanicals and Pinouts
4.2
Figure 2
12
15X
e
Y
E
shows MCF5328CVM240 and MCF5329CVM240 package dimensions.
Package Dimensions—256 MAPBGA
S
X
0.20
16
15
14
Laser mark for pin A1
identification in
this area
Bottom View
13
12
Top View
View M-M
11
10
D
7
6
MCF5329 ColdFire
5
15X
S
4
3
e
2
1
Figure 2. 256 MAPBGA Package Outline
G
M
A
B
C
D
E
F
H
K
L
N
P
R
T
J
Metalized mark for
pin A1 identification
in this area
K
256X
®
M
M
0.25
0.10
b
Microprocessor Data Sheet, Rev. 0.1
Preliminary
3
M
M
Z
Z
X
Y
A
A2
A1
Notes:
Z
Rotated 90° Clockwise
1.
2.
3.
4.
5.
4
Detail K
Dimensions are in millimeters.
Interpret dimensions and tolerances
per ASME Y14.5M, 1994.
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
Datum Z (seating plane) is defined by
the spherical crowns of the solder
balls.
Parallelism measurement shall exclude
any effect of mark on top surface of
package.
Dim
A1
A2
A
D
E
S
b
e
1.25
0.27
0.40
Millimeters
Min
256X
17.00 BSC
17.00 BSC
1.16 REF
1.00 BSC
0.50 BSC
0.15
1.60
0.47
0.60
Max
Freescale Semiconductor
Z
0.30
5
Z