STR910FAZ32H6T STMICROELECTRONICS [STMicroelectronics], STR910FAZ32H6T Datasheet - Page 93

• Manufacturer Part Number: STR910FAZ32H6T
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STR91xFAx32 STR91xFAx42 STR91xFAx44
Figure 39. 144-ball low profile fine pitch ball grid array package (LFBGA144)
Figure 40. Recommended PCB Design rules (0.80/0.75mm pitch BGA)
Dpad
Dsm
Dpad
Dsm
Solder paste
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
1
Dim.
Values in inches are converted from mm and
ddd
eee
A1
A2
D1
E1
fff
A
b
D
E
F
N
e
rounded to 4 decimal digits.
Min
1.21
0.21
0.35
9.85
9.85
0.37 mm
0.52 mm typ. (depends on solder
mask registration tolerance
0.37 mm aperture diameter
1.085
10.00 10.15 0.3878 0.3937 0.3996
10.00 10.15 0.3878 0.3937 0.3996
mm
Typ
0.40
8.80
8.80
0.80
0.60
Max
Number of Pins
1.70
0.45
0.10
0.15
0.08
Package mechanical data
144
0.0476
0.0083
0.0138 0.0157 0.0177
Min
inches
0.0427
0.3465
0.3465
0.0315
0.0236
Typ
1)
0.0669
0.0039
0.0059
0.0031
Max
93/99