LPC2292FBD144/00 PHILIPS [NXP Semiconductors], LPC2292FBD144/00 Datasheet - Page 50

• Manufacturer Part Number: LPC2292FBD144/00
• Description: 16/32-bit ARM microcontrollers; 256 kB ISP/IAP flash with CAN, 10-bit ADC and external memory interface
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
Fig 26. Package outline SOT569-1 (TFBGA144)
LPC2292_2294_6
Product data sheet
TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT569-1
max.
1.2
A
ball A1
index area
ball A1
index area
shape
optional (4
0.36
0.24
A 1
M
G
0.84
0.74
N
L
K
H
F
E
D
C
B
A
J
A 2
IEC
1
0.53
0.43
b
2
e
3
12.2
11.8
4
D
5
6
11.9
11.7
D 1
D 1
e 1
D
7
MO-216
JEDEC
8
12.2
11.8
9
E
10
0
REFERENCES
Rev. 06 — 10 December 2007
16/32-bit ARM microcontrollers with external memory interface
11
b
11.9
11.7
12
E 1
13
0.8
e
JEITA
scale
E 1
e
B
5
9.6
e 2
e 1
A
E
w
v
M
M
C
C
9.6
e 2
A
B
10 mm
0.15
v
A
LPC2292/LPC2294
0.08
w
y 1 C
A 2
0.1
A
y
1
PROJECTION
EUROPEAN
0.1
y 1
detail X
X
C
y
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
03-07-09
05-09-14
SOT569-1
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