AT32UC3B0512-A2UES ATMEL [ATMEL Corporation], AT32UC3B0512-A2UES Datasheet - Page 53

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AT32UC3B0512-A2UES

Manufacturer Part Number
AT32UC3B0512-A2UES
Description
32-bit AVR Microcontroller
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
10. Mechanical Characteristics
10.1
10.1.1
10.1.2
Thermal Considerations
Thermal Data
Junction Temperature
Table 10-1
Table 10-1.
The average chip-junction temperature, T
where:
• θ
• θ
• θ
• P
• T
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
page 53.
Table 10-1 on page 53.
Consumption” on page
JA
JC
JA
JC
JA
JC
HEAT SINK
A
D
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in Table 10-1 on
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
T
T
J
J
=
=
T
summarizes the thermal resistance data depending on the package.
A
T
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
A
Thermal Resistance Data
P (
+
D
(
×
P
θ (
D
HEATSINK
×
41.
θ
JA
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
49.6
13.5
51.1
13.7
Typ
“Power
J
⋅C/W
⋅C/W
Unit
in °C.

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