UAA2080H PHILIPS [NXP Semiconductors], UAA2080H Datasheet - Page 15

• Manufacturer Part Number: UAA2080H
• Description: Advanced pager receiver
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
See Table 4 for bonding pad description and locations for x/y co-ordinates.
1996 Jan 15
handbook, full pagewidth
Advanced pager receiver
Chip area: 18.15 mm
Chip thickness: 380 20 m.
Drawing not to scale.
2
.
3.83
mm
25
26
27
28
1
2
3
4
Where:
y
0
Pad number 1 (diameter 124 m)
Pad 124 m x 124 m
Pad not used
Pad 100 m x 100 m
Pad 100 m x 100 m with reference point
0
24
5
Fig.9 Bonding pad locations.
6
23
UAA2080U
7
4.74 mm
22
15
8
21
9
20
10
19
MLC707
11
17
16
15
14
13
12
18
x
Product specification
UAA2080