MC35XS3400CHFK FREESCALE [Freescale Semiconductor, Inc], MC35XS3400CHFK Datasheet
MC35XS3400CHFK
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MC35XS3400CHFK Summary of contents
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... This document contains certain information on a new product. Specifications and information herein are subject to change without notice. © Freescale Semiconductor, Inc., 2008 - 2012. All rights reserved. MOSFETs (quad DS(ON) (for Tape and Reel orders add an R2 suffix to the part) MC35XS3400CHFK MC35XS3400DHFK PWR ...
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DEVICE VARIATIONS Table 1. Device Variations Characteristic Wake Input Clamp Voltage, I < 2.5 mA CL(WAKE) 35XS3400CHFK 35XS3400DHFK Fault Detection Blanking Time 35XS3400CHFK 35XS3400DHFK Output Shutdown Delay Time 35XS3400CHFK 35XS3400DHFK (Notes) Open-load detection time in OFF state 35XS3400CHFK and 35XS3400DHFK ...
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VDD V Failure Detection CS SCLK I DWN SO SI RST WAKE FS IN0 IN1 IN2 IN3 DWN DWN DWN PWM Module Calibratable Oscillator V REG Programmable FSI Watchdog Over-temperature Prewarning Figure 2. 35XS3400 ...
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PIN CONNECTIONS Transparent Top View of Package SO GND HS3 Table 2. 35XS3400 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section beginning on page 19. Pin Pin Pin Name Number Function ...
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Table 2. 35XS3400 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on page 19. Pin Pin Pin Name Number Function 13 VDD Power Digital Drain Voltage 14, 17, 23 ...
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ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS V Supply Voltage Range PWR Load ...
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STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER INPUTS Battery Supply Voltage Range Fully Operational (11) ...
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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic OUTPUTS HS0 TO HS3 (Continued) Output ...
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Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic OUTPUTS HS0 TO HS3 (continued) C Current Recopy Temperature Drift (6.0 ...
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ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. Static Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic CONTROL INTERFACE (21) Input Logic High ...
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DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 Output Rising Medium ...
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ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic POWER OUTPUT TIMING HS0 TO HS3 ...
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Table 5. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic Output Over-current Time Step OC[1:0]=00 (slow by default) OC[1:0]=01 (fast) OC[1:0]=10 ...
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ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic Bulb Cooling Time Step CB[1:0]=00 or ...
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Table 5. Dynamic Electrical Characteristics (continued) Characteristics noted under conditions 6.0 V ≤ V otherwise noted. Typical values noted reflect the approximate parameter means at T otherwise noted. Characteristic TEMPERATURE ON THE GND FLAG (36) Thermal Prewarning Detection Analog Temperature ...
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ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS IN[0:3] high logic level low logic level CS high logic level low logic level V HS[0:3] V PWR V HS[0:3] 70% V PWR 30% V PWR I OCH 1 I OCH2 I OC1 Load I OC2 ...
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I OCH 1 I OCH2 I OC1 I OC2 I OC3 I OC4 I OCLO4 I OCLO3 I OCLO2 I OCLO1 RSTB RST 10% V 0.2 VDD TwRSTB t ENBL t W RST TENBL CS CSB 10% V 0.7VDD DD ...
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ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS 90% V 3.5V SCLK SCLK SO 0.2 VDD SO 10% V Low-to-High Low to High SO SO 90% V 0.7 VDD High to Low High-to-Low Figure 8. SCLK Waveform and Valid SO Data Delay Time 35XS3400 ...
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The 35XS3400 is one in a family of devices designed for low-voltage automotive lighting applications. Its four low R MOSFETs (quad 35 mΩ) can control four separate DS(ON bulbs. Programming, control and diagnostics are accomplished using a 16-bit ...
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FUNCTIONAL DESCRIPTION FUNCTIONAL INTERNAL BLOCK DESCRIPTION GROUND (GND) These pins are the ground for the device. POSITIVE POWER SUPPLY (VPWR) This pin connects to the positive power supply and is the source of operational power for the device. The VPWR ...
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Hz) and addressing the dimming application (day running light). An analog feedback output provides a current proportional to the load current or the temperature of the board. The SPI is used to ...
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FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION SPI PROTOCOL DESCRIPTION The SPI interface has a full duplex, three-wire synchronous data transfer with four I/O lines associated with it: Serial Input (SI), Serial Output (SO), Serial Clock (SCLK), and Chip ...
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Fail Safe SLEEP MODE The 35XS3400 is in Sleep mode when: • V and V are within the normal voltage range, PWR DD • wake- • fail ...
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FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES Table 8. Output PWM Switching Delay Delay bits Output delay 000 no delay 001 16 PWM clock periods 010 32 PWM clock periods 011 48 PWM clock periods 100 64 PWM clock periods 101 80 ...
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FAULT MODE The 35XS3400 is in Fault mode when: • V and V are within the normal voltage range, PWR DD • wake- • fail = X, • fault=1. This device indicates the faults below as they occur ...
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FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES the failure condition must disappear and the auto-retry circuitry must be active or the corresponding output must be commanded OFF and then ON (toggling fault_control signal of corresponding output SUPPLY(POR) V ...
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ShortVpwr=1 (fault_control=1 and OV=0) or OV=1) OFF if hson=0 (fault_control=0 or OV=1) (fault_control=0) AUTO-RETRY The auto-retry circuitry is used to reactivate the output(s) automatically in case of over-current or over-temperature or under-voltage failure conditions to provide a high ...
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FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES bit will be set to a logic [1], the output will stay ON and FS will not be disturbed. Open-load Detection In On State For Led Open load for LEDs only (OLLED[0:3] set ...
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SERIAL INPUT COMMUNICATION SPI communication is accomplished using 16-bit messages. A message is transmitted by the MCU starting with the MSB D15 and ending with the LSB, D0 Each incoming command message on the SI pin can be interpreted using ...
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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS DEVICE REGISTER ADDRESSING The following section describes the possible register addresses (D[14:10]) and their impact on device operation. ADDRESS XX000 — STATUS REGISTER (STATR_S) The STATR register is used to read the device ...
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Table 15. Current Sense Ratio Selection CSNS_high_s (D0) Current Sense Ratio 0 CRS0 (default) 1 ADDRESS A A 100 — OUTPUT OVER-CURRENT 1 0 REGISTER (OCR) The OCR_s register allows the MCU to configure corresponding output over-current protection through the ...
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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 22. Output Current Recopy Selection CSNS1 (D3) CSNS0 (D2) CSNS reporting 0 0 HS0 (default The GCR register disables the over-voltage protection (D0). When this bits ...
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Table 23. Serial Output Bit Map Description Previous STATR STATR WDI SOA SOA SOA ...
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FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS PREVIOUS ADDRESS SOA4 : SOA0 = A (CONFR0_S) The returned data contains the programmed values in the CONFR0 register for the output selected with A PREVIOUS ADDRESS SOA4 : SOA0 = A (CONFR1_S) ...
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The following figure shows a typical automotive lighting application (only one vehicle corner) using an external PWM clock from the main MCU. A redundancy circuitry has been V PWR Voltage regulator 100nF 10µF 100nF 10k V ...
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PACKAGING SOLDERING INFORMATION The 35XS3400 is packaged in a surface mount power package intended to be soldered directly on the printed circuit board. 35XS3400 36 PACKAGING SOLDERING INFORMATION The AN2467 Power Quad Flat No-Lead (PQFN) Package provides guidelines for Printed ...
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For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARL10596D listed below. Dimensions shown are provided for reference ONLY. Analog Integrated Circuit Device Data Freescale Semiconductor PACKAGE DIMENSIONS FK SUFFIX 24-PIN PQFN NONLEADED PACKAGE ...
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PACKAGING PACKAGE DIMENSIONS 35XS3400 38 FK SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D Analog Integrated Circuit Device Data Freescale Semiconductor ...
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Analog Integrated Circuit Device Data Freescale Semiconductor FK SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D PACKAGING PACKAGE DIMENSIONS 35XS3400 39 ...
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PACKAGING PACKAGE DIMENSIONS 35XS3400 40 FK SUFFIX 24-PIN PQFN NONLEADED PACKAGE 98ARL10596D ISSUE D Analog Integrated Circuit Device Data Freescale Semiconductor ...
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ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Introduction This thermal addendum is provided as a supplement to the 35XS3400 technical data sheet. The addendum provides thermal performance information that may be critical in the design and development of system applications. All ...
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ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) 76.2mm Figure 15. 1s JEDEC Thermal Test Board Layout Transparent Top View MC35XS3400 Pin Connections 24 Pin PQFN (12 x 12) 0.9mm Pitch 12.0mm x 12.0mm Body 35XS3400 42 Figure 16. 2s2p JEDEC Thermal ...
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Device on Thermal Test Board Material: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.07 mm thickness Cu buried traces thickness 0.035 mm Outline: 76 114.3 mm board area, including edge connector for thermal testing, ...
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ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) 100 10 1 0.1 0.000001 Figure 19. Transient Thermal 1W Step Response; Device on 1s JEDEC Standard Thermal Test Board with Heat Spreading Areas 600 Sq. mm 100 10 1 0.1 0.000001 Figure 20. ...
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... Previous Address SOA4 : SOA0 = 10111 (diagr2) on page 100) for protected. • Updated part number MC35XS3400DPNA to MC35XS3400DHFK and MC35XS3400CPNA to 05/2012 9.0 MC35XS3400CHFK. • Updated the pin soldering temperature limit from 10 seconds to 40 seconds (Note • Updated Freescale form and style. Analog Integrated Circuit Device Data Freescale Semiconductor ...
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How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MC35XS3400 Rev. 9.0 05/2012 Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright ...