SAF-XE167F-48F66L INFINEON [Infineon Technologies AG], SAF-XE167F-48F66L Datasheet - Page 121

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SAF-XE167F-48F66L

Manufacturer Part Number
SAF-XE167F-48F66L
Description
16-Bit Single-Chip Real Time Signal Controller
Manufacturer
INFINEON [Infineon Technologies AG]
Datasheet

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Part Number
Manufacturer
Quantity
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Part Number:
SAF-XE167F-48F66L AC
Manufacturer:
Infineon Technologies
Quantity:
10 000
5.2
When operating the XE167 in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
power dissipation must be limited so that the average junction temperature does not
exceed 125 °C.
The difference between junction temperature and ambient temperature is determined by
∆T = (
The internal power consumption is defined as
P
The static external power consumption caused by the output drivers is defined as
P
The dynamic external power consumption caused by the output drivers (
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
Data Sheet
INT
IOSTAT
Reduce
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
=
P
V
INT
= Σ((
DDP
+
Thermal Considerations
V
×
V
P
DDP
I
DDP
IOSTAT
DDP
, if possible in the system
-
V
(see
OH
+
) ×
P
Section
IODYN
I
OH
) + Σ(
) ×
R
4.2.3).
ΘJA
V
OL
×
I
OL
119
)
R
ΘJA
” quantifies these parameters. The
XE166 Family Derivatives
Package and Reliability
P
IODYN
V2.1, 2008-08
) depends
XE167x

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