PIC18F248-E/L MICROCHIP [Microchip Technology], PIC18F248-E/L Datasheet - Page 385

• Manufacturer Part Number: PIC18F248-E/L
• Description: 28/40-Pin High-Performance, Enhanced Flash Microcontrollers with CAN Module
• Manufacturer: MICROCHIP [Microchip Technology]

44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Note:
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-076
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
B
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
A2
D1
n1
A1
E1
F
E
D
B
n
p
A
L
c
n
MIN
.037
.390
.390
.004
.039
.002
.018
.463
.463
.012
.025
2
1
0
5
5
D1
L
.039 REF.
CH x 45°
INCHES
D
NOM
.031
44
11
.004
.394
.394
.043
.039
.024
.472
.472
.006
.015
.035
A1
3.5
10
10
A
F
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.30
0.64
0.09
0
5
5
MILLIMETERS*
1.00 REF.
PIC18FXX8
NOM
12.00
12.00
10.00
10.00
1.10
1.00
0.10
0.15
0.38
0.60
0.89
Revised 07-22-05
3.5
10
10
0.80
44
11
A2
DS41159E-page 383
MAX
12.25
12.25
10.10
10.10
0.44
1.14
1.20
1.05
0.15
0.75
0.20
15
15
7