XC73144-12 XILINX [Xilinx, Inc], XC73144-12 Datasheet - Page 11
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XC73144-12
Manufacturer Part Number
XC73144-12
Description
144-Macrocell CMOS EPLD
Manufacturer
XILINX [Xilinx, Inc]
Datasheet
1.XC73144-12.pdf
(11 pages)
XC73144 CMOS EPLD
For a detailed description of the device architecture, see the XC7300 CMOS EPLD Family data sheet, page 2-1
through 2-10.
For a detailed description of the device timing, see pages 2-9, 2-10 and 2-50 through 2-52.
For package physical dimensions and thermal data, see Section 4.
Ordering Information
Speed Options
Packaging Options
Temperature Options
Component Availability
Pins
Type
Code
XC73144
C
I
C = Commercial = 0° to +70°C
Parenthesis indicate future product plans
-15
-12
-10
-7
PQ160 160-Pin Plastic Quad Flat Pack
BG225 225-Pin Plastic Ball-Grid-Array
Commercial
Industrial
-15
-12
-10
-7
15 ns pin-to-pin delay
12 ns pin-to-pin delay
10 ns pin-to-pin delay (commercial only)
7.5 ns pin-to-pin delay (commercial only)
Plastic
PLCC
PC44
-40
Ceramic
CLCC
WC44
0
44
o
o
C to 85
C to 70
Plastic
PQFP
PQ44
I = Industrial = -40° to 85°C
o
o
Device Type
C
C
Plastic
PLCC
PC68
XC73144 - 7 PQ 160 C
68
Speed
Ceramic
WC68
CLCC
2-75
Plastic
PLCC
PC84
84
Ceramic
CLCC
WC84
Package Type
Number of Pins
PQ100
Plastic
PQFP
100
Temperature Range
Ceramic
PG144
144
PGA
PQ160
Plastic
PQFP
160
CI
CI
C
C
Plastic
BG225
BGA
CI
CI
C
C
225
Ceramic
WB225
BGA
CI
CI
C
C
X5654