XC5204 XILINX [Xilinx, Inc], XC5204 Datasheet - Page 45

• Manufacturer Part Number: XC5204
• Description: Field Programmable Gate Arrays
• Manufacturer: XILINX [Xilinx, Inc]

XC5200 Switching Characteristics
Definition of Terms
In the following tables, some specifications may be designated as Advance or Preliminary. These terms are defined as
follows:
Advance:
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked:
XC5200 Operating Conditions
XC5200 DC Characteristics Over Operating Conditions
XC5200 Absolute Maximum Ratings
1. Notwithstanding the definition of the above terms, all specifications are subject to change without notice.
November 5, 1998 (Version 5.2)
V
V
V
V
V
T
V
V
I
I
C
I
Note:
V
V
V
T
T
T
Note:
Symbol
Symbol
CCO
IL
RIN
STG
SOL
IN
OH
OL
J
CC
IHT
ILT
IHC
ILC
CC
IN
TS
IN
Symbol
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Recommended
Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may
affect device reliability.
1. With no output current loads, all package pins at Vcc or GND, either TTL or CMOS inputs, and the FPGA configured with a
Supply voltage relative to GND Commercial: 0 C to 85 C junction
Supply voltage relative to GND Industrial: -40 C to 100 C junction
High-level input voltage — TTL configuration
Low-level input voltage — TTL configuration
High-level input voltage — CMOS configuration
Low-level input voltage — CMOS configuration
Input signal transition time
High-level output voltage @ I
Low-level output voltage @ I
Quiescent FPGA supply current (Note 1)
Leakage current
Input capacitance (sample tested)
Pad pull-up (when selected) @ V
tie option.
Supply voltage relative to GND
Input voltage with respect to GND
Voltage applied to 3-state output
Storage temperature (ambient)
Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
Junction temperature in plastic packages
Junction temperature in ceramic packages
Specifications not identified as either Advance or Preliminary are to be considered Final.
families. Use as estimates, not for production.
R
Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or device
OL
OH
Description
= 8.0 mA, V
= -8.0 mA, V
IN
Description
Description
= 0V (sample tested)
CC
CC
max
min
XC5200 Series Field Programmable Gate Arrays
-0.5 to +7.0
-0.5 to V
-0.5 to V
-65 to +150
+260
+125
+150
CC
CC
+0.5
+0.5
70%
4.75
3.86
0.02
Min
Min
-10
4.5
2.0
0
0
1
100%
Max
5.25
20%
Max
0.30
250
+10
V
5.5
0.8
0.4
15
15
CC
Units
Units
Units
V
V
mA
mA
pF
ns
V
V
V
V
V
V
V
V
V
7-127
C
C
C
C
CC
CC
A
7