PCA9674AD NXP [NXP Semiconductors], PCA9674AD Datasheet

PCA9674AD

Manufacturer Part Number

PCA9674AD

Description

Remote 8-bit I/O expander for Fm+ I2C-bus with interrupt

Manufacturer

NXP [NXP Semiconductors]

Datasheet

1.PCA9674AD.pdf (32 pages)

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1. General description

2. Features

The PCA9674/74A provide general purpose remote I/O expansion for most

microcontroller families via the two-line bidirectional bus (I

Fast-mode Plus (Fm+) family.

The PCA9674/74A is a drop-in upgrade for the PCF8574/74A providing higher Fast-mode

Plus I

dimming of LEDs, higher I

can be on the bus without the need for bus buffers, higher total package sink capacity

(200 mA versus 100 mA) that supports having all LEDs on at the same time and more

device addresses (64 versus 8) are available to allow many more devices on the bus

without address conﬂicts.

The devices consist of an 8-bit quasi-bidirectional port and an I

PCA9674/74A have low current consumption and include latched outputs with 25 mA high

current drive capability for directly driving LEDs.

They also possess an interrupt line (INT) that can be connected to the interrupt logic of

the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform

the microcontroller if there is incoming data on its ports without having to communicate via

the I

The internal Power-On Reset (POR) or Software Reset sequence initializes the I/Os as

inputs.

PCA9674/74A

Remote 8-bit I/O expander for Fm+ I

Rev. 05 — 15 June 2009

1 MHz I

Compliant with the I

SDA with 30 mA sink capability for 4000 pF buses

2.3 V to 5.5 V operation with 5.5 V tolerant I/Os

8-bit remote I/O pins that default to inputs at power-up

Latched outputs with 25 mA sink capability for directly driving LEDs

Total package sink capability of 200 mA

Active LOW open-drain interrupt output

64 programmable slave addresses using 3 address pins

Readable device ID (manufacturer, device type, and revision)

Low standby current

ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115, and 1000 V CDM per JESD22-C101

40 C to +85 C operation

C-bus.

C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWM

C-bus interface

C-bus Fast and Standard modes

C-bus drive (30 mA versus 3 mA) so that many more devices

C-bus with interrupt

C-bus) and is a part of the

C-bus interface. The

Product data sheet

Related parts for PCA9674AD

PCA9674AD Summary of contents

Page 1

PCA9674/74A Remote 8-bit I/O expander for Fm+ I Rev. 05 — 15 June 2009 1. General description The PCA9674/74A provide general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I Fast-mode Plus (Fm+) family. The ...

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... Instrumentation and test measurement 4. Ordering information Table 1. Ordering information Type number Topside mark PCA9674BS 674 PCA9674ABS 74A PCA9674D PCA9674D PCA9674AD PCA9674AD PCA9674PW PCA9674 PCA9674APW PA9674A PCA9674TS PCA9674 PCA9674ATS PA9674A PCA9674_PCA9674A_5 Product data sheet Remote 8-bit I/O expander for Fm+ I Package Name Description HVQFN16 plastic thermal enhanced very thin quad ﬂ ...

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NXP Semiconductors 5. Block diagram INT AD0 AD1 AD2 SCL SDA Fig 1. data from Shift Register data to Shift Register Fig 2. PCA9674_PCA9674A_5 Product data sheet Remote 8-bit I/O expander for Fm+ I PCA9674 PCA9674A ...

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... V DD AD0 AD1 n.c. AD2 P0 Fig 5. PCA9674_PCA9674A_5 Product data sheet Remote 8-bit I/O expander for Fm SDA 3 14 SCL PCA9674D INT PCA9674AD 002aac111 Pin conﬁguration for SO16 ...

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NXP Semiconductors 6.2 Pin description Table 2. Symbol AD0 AD1 AD2 INT SCL SDA V DD Table 3. Symbol INT SCL n.c. SDA V DD AD0 AD1 n.c. AD2 P0 ...

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NXP Semiconductors Table 4. Symbol AD2 [ INT SCL SDA V DD AD0 AD1 [1] HVQFN16 package die supply ground is connected to both the and board-level ...

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NXP Semiconductors Fig 7. The last bit of the ﬁrst byte deﬁnes the operation to be performed. When set to logic 1 a read is selected, while a logic 0 selects a write operation. When AD2, AD1 and AD0 are ...

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NXP Semiconductors Table 5. AD2 SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL ...

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NXP Semiconductors Table 6. AD2 ...

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NXP Semiconductors Table 6. AD2 SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA SCL SCL SCL SCL SDA SDA SDA SDA [1] The PCA9674A does not acknowledge when AD2, AD1, AD0 follows ...

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NXP Semiconductors Fig 9. 7.2.1 Software Reset The Software Reset Call allows all the devices in the I state value through a speciﬁc formatted I implies that the I The Software Reset sequence is deﬁned as following START ...

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NXP Semiconductors 7.2.2 Device ID (PCA9674/74A ID ﬁeld) The Device ID ﬁeld is a 3-byte read-only (24 bits) word giving the following information: • 8 bits with the manufacturer name, unique per manufacturer (for example, NXP). • 13 bits with ...

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NXP Semiconductors S 1 START condition M7 manufacturer name = 00000000 Fig 12. Device ID ﬁeld reading 8. I/O programming 8.1 Quasi-bidirectional I/O architecture The PCA9674/74A’s 8 ports (see either as input or output ports. Input data is transferred from ...

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NXP Semiconductors SCL slave address SDA START condition write to port data output from port P5 output voltage P5 pull-up output current INT Fig 13. ...

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NXP Semiconductors 8.4 Power-on reset When power is applied to V PCA9674/74A in a reset condition until V condition is released and the PCA9674/74A registers and I will initialize to their default states. Thereafter V the device. 8.5 Interrupt output ...

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NXP Semiconductors 9. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be ...

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NXP Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 18. System conﬁguration 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed ...

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NXP Semiconductors 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in P7 are outputs. When used in this conﬁguration, during a write, the input (P0 and P1) must be written as HIGH ...

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NXP Semiconductors 11. Limiting values Table 7. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot P/out T stg T amb [1] Total package ...

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NXP Semiconductors 12. Static characteristics Table 8. Static characteristics Symbol Parameter Supplies V supply voltage DD I supply current DD I standby current stb V power-on ...

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NXP Semiconductors 13. Dynamic characteristics Table 9. Dynamic characteristics Symbol Parameter f SCL clock frequency SCL t bus free time between a BUF STOP and START ...

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NXP Semiconductors START protocol condition (S) t SU;STA SCL t BUF SDA t HD;STA Rise and fall times refer Fig 22. I C-bus timing diagram PCA9674_PCA9674A_5 Product data sheet Remote 8-bit I/O expander for Fm+ I bit ...

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NXP Semiconductors 14. Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS ...

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NXP Semiconductors SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. ...

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NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...

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NXP Semiconductors SSOP20: plastic shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.4 mm 1.5 ...

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NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages ...

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NXP Semiconductors • Process issues, such as application of adhesive and ﬂux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath speciﬁcations, including temperature and impurities ...

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NXP Semiconductors Fig 27. Temperature proﬁles for large and small components For further information on temperature proﬁles, refer to Application Note AN10365 “Surface mount reﬂow soldering description” . 17. Abbreviations Table 12. Acronym CDM ESD GPIO HBM LED IC 2 ...

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NXP Semiconductors 18. Revision history Table 13. Revision history Document ID Release date PCA9674_PCA9674A_5 20090615 • Modiﬁcations: Table 8 “Static – – PCA9674_PCA9674A_4 20090303 PCA9674_PCA9674A_3 20070907 PCA9674_PCA9674A_2 20061012 PCA9674_PCA9674A_1 20060905 PCA9674_PCA9674A_5 Product data sheet Remote 8-bit I/O expander for Fm+ ...

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NXP Semiconductors 19. Legal information 19.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualiﬁcation Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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