TDA9898HL/V3 NXP [NXP Semiconductors], TDA9898HL/V3 Datasheet - Page 95
![no-image](/images/no-image-200.jpg)
TDA9898HL/V3
Manufacturer Part Number
TDA9898HL/V3
Description
Multistandard hybrid IF processing
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.TDA9898HLV3.pdf
(103 pages)
- Current page: 95 of 103
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NXP Semiconductors
15. Package outline
Fig 52. Package outline SOT313-2 (LQFP48)
TDA9897_TDA9898_4
Product data sheet
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT313-2
max.
1.6
48
A
37
y
0.20
0.05
36
A
1
1
e
1.45
1.35
A
2
136E05
IEC
pin 1 index
0.25
b
A
p
3
H
D
D
0.27
0.17
b
w
p
M
0.18
0.12
c
X
MS-026
JEDEC
Z D
12
25
D
7.1
6.9
(1)
REFERENCES
B
24
13
E
7.1
6.9
Rev. 04 — 25 May 2009
0
(1)
Z E
b
0.5
e
e
w
p
M
JEITA
v
v
scale
2.5
9.15
8.85
H
M
M
D
A
B
A
E
9.15
8.85
H
H
E
E
5 mm
L
1
0.75
0.45
L
TDA9897; TDA9898
A
p
A
Multistandard hybrid IF processing
2
0.2
v
A
1
0.12
w
PROJECTION
EUROPEAN
detail X
0.1
y
Z
0.95
0.55
D
L
(1)
L
p
© NXP B.V. 2009. All rights reserved.
Z
0.95
0.55
E
ISSUE DATE
(1)
(A )
00-01-19
03-02-25
3
7
0
SOT313-2
o
o
95 of 103
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