CY7C68300C CYPRESS [Cypress Semiconductor], CY7C68300C Datasheet - Page 40

• Manufacturer Part Number: CY7C68300C
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document 001-05809 Rev. *A
Quad Flat Package No Leads (QFN) Package Design Notes
Electrical contact of the part to the Printed Circuit Board (PCB)
is made by soldering the leads on the bottom surface of the
package to the PCB. Hence, special attention is required to the
heat transfer area below the package to provide a good
thermal bond to the circuit board. A Copper (Cu) fill must be
designed into the PCB as a thermal pad under the package.
Heat is transferred from the AT2LP through the device’s metal
paddle on the bottom side of the package. Heat from here is
conducted to the PCB at the thermal pad. It is then conducted
from the thermal pad to the PCB inner ground plane by a 5 x
5 array of vias. A via is a plated through-hole in the PCB with
a finished diameter of 13 mil. The QFN’s metal die paddle must
be soldered to the PCB’s thermal pad. Solder mask is placed
on the board top side over each via to resist solder flow into
Figure 16
Other Design Considerations
Certain design considerations must be followed to ensure
proper operation of the CY7C68300C/CY7C68301C. The
following items must be taken into account when designing a
USB device with the CY7C68300C/CY7C68301C.
Figure 16. Plot of the Solder Mask (White Area)
is a plot of solder mask pattern and
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 15. Cross-Section of the Area Under the QFN Package
PCB Material
Figure 17
Cu Fill
displays an X-Ray image of assembly (darker areas indicate solder).
Solder Mask
0.013” dia
0.017” dia
the via. The mask on the top side also minimizes outgassing
during the solder reflow process.
For further information on this package design, refer to the
application note Surface Mount Assembly of AMKOR’s
MicroLeadFrame (MLF) Technology. The application note
provides detailed information on board mounting guidelines,
soldering flow, rework process, etc.
Figure 15
package. The cross section is of only one via. The solder paste
template needs to be designed to allow at least 50% solder
coverage. The thickness of the solder paste template must be
5 mil. It is recommended that ’No Clean,’ type 3 solder paste
is used for mounting the part. Nitrogen purge is recommended
during reflow.
Proper Power Up Sequence
Power must be applied to the CY7C68300C/CY7C68301C
before, or at the same time as the ATA/ATAPI device. If power
is supplied to the drive first, the CY7C68300C/CY7C68301C
startup in an undefined state. Designs that utilize separate
power supplies for the CY7C68300C/CY7C68301C and the
ATA/ATAPI device are not recommended.
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane
Cu Fill
Figure 17. X-Ray Image of the Assembly
displays a cross-sectional area underneath the
PCB Material
CY7C68300C/CY7C68301C
CY7C68320C/CY7C68321C
Page 40 of 42
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