S29GL128S SPANSION [SPANSION], S29GL128S Datasheet - Page 97

• Manufacturer Part Number: S29GL128S
• Manufacturer: SPANSION [SPANSION]

12. Special Handling Instructions for FBGA Package
March 16, 2012 S29GL_128S_01GS_00_06
11.3.2
Physical Diagram - VBU 056
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
PACKAGE
JEDEC
SYMBOL
9
SD / SE
MD
ME
A1
D1
E1
D
N
A
E
e
INDEX MARK
b
A1 CORNER
0.10
(2X)
A
MIN
0.17
0.35
A1,A8,D4,D5,E4,E5,H1,H8
9.00 mm x 7.00 mm NOM
---
A1
C
PACKAGE
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
VBU 056
NOM
0.40
N/A
56
---
---
8
8
D a t a
MAX
1.00
0.45
SIDE VIEW
---
TOP VIEW
D
SEATING PLANE
OVERALL THICKNESS
BALL HEIGHT
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
GL-S MirrorBit
S h e e t
NOTE
®
A
0.10
(2X)
Family
E
B
C
C
e
NOTES:
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
1. DIMENSIONING AND TOLERANCING METHODS PER
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE
6
7
8. "+" INDICATES THE THEORETICAL CENTER OF
9
0.10
0.08
56 b
ASME Y14.5M-1994.
4.3, SPP-010.
"D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF POPULATED SOLDER
BALL POSITIONS FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
DEPOPULATED BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
6
e
C
C
0.08
0.15
H
M C
M
G
BOTTOM VIEW
C
A
F
B
E
D1
D
C
SD
B
A
7
8
7
6
5
4
3
2
1
g1055\ 16-038.25 \ 01.26.12
A1 CORNER
SE
7
E1
97