S29GL128S SPANSION [SPANSION], S29GL128S Datasheet - Page 3

• Manufacturer Part Number: S29GL128S
• Manufacturer: SPANSION [SPANSION]

General Description
Distinctive Characteristics
This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient pro-
duction volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid com-
binations offered may occur.
The Spansion
devices offer a fast page access time as fast as 15 ns with a corresponding random access time as fast as 90 ns. They feature
a Write Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective
programming time than standard programming algorithms. This makes these devices ideal for today’s embedded applications
that require higher density, better performance and lower power consumption.
 65 nm MirrorBit Eclipse Technology
 Single supply (V
 Versatile I/O Feature
 x16 data bus
 Asynchronous 32-byte Page read
 512-byte Programming Buffer
 Single word and multiple program on same word options
 Sector Erase
 Suspend and Resume commands for Program and Erase
GL-S MirrorBit
Non-Volatile Memory Family
S29GL01GS
S29GL512S
S29GL256S
S29GL128S
CMOS 3.0 Volt Core with Versatile I/O
Data Sheet
– Wide I/O voltage range (V
– Programming in Page multiples, up to a maximum of 512 bytes
– Uniform 128-kbyte sectors
operations
®
S29GL01G/512/256/128S are MirrorBit Eclipse flash products fabricated on 65 nm process technology. These
Publication Number S29GL_128S_01GS_00
CC
) for read / program / erase (2.7V to 3.6V)
1 Gbit
512 Mbit
256 Mbit
128 Mbit
IO
): 1.65V to V
®
CC
Eclipse
(128 Mbyte)
(64 Mbyte)
(32 Mbyte)
(16 Mbyte)
™
Flash
 Status Register, Data Polling, and Ready/Busy pin methods
 Advanced Sector Protection (ASP)
 Separate 1024-byte One Time Program (OTP) array with two
 Common Flash Interface (CFI) parameter table
 Industrial temperature range (-40°C to +85°C)
 100,000 erase cycles for any sector typical
 20-year data retention typical
 Packaging Options
Revision 06
to determine device status
– Volatile and non-volatile protection methods for each sector
lockable regions
– 56-pin TSOP
– 64-ball LAA Fortified BGA, 13 mm x 11 mm
– 64-ball LAE Fortified BGA, 9 mm x 9 mm
– 56-ball VBU Fortified BGA, 9 mm x 7 mm
Issue Date March 16, 2012