LTC2226 LINER [Linear Technology], LTC2226 Datasheet - Page 27

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LTC2226

Manufacturer Part Number
LTC2226
Description
12-Bit, 65/40/25Msps Low Power 3V ADCs
Manufacturer
LINER [Linear Technology]
Datasheet

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PACKAGE DESCRIPTION
5.50 0.05
4.10 0.05
(4 SIDES)
3.50 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
3.45 0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 0.10
(4 SIDES)
3.45 0.05
0.50 BSC
0.25 0.05
(Reference LTC DWG # 05-08-1693 Rev D)
32-Lead Plastic QFN (5mm × 5mm)
0.70 0.05
PACKAGE OUTLINE
UH Package
0.75 0.05
LTC2228/LTC2227/LTC2226
(4-SIDES)
3.50 REF
0.200 REF
0.00 – 0.05
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
3.45 0.10
TYP
3.45 0.10
31
0.50 BSC
0.25 0.05
32
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 45 CHAMFER
(UH32) QFN 0406 REV D
1
2
0.40 0.10
27
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