HCF4093BEY STMicroelectronics, HCF4093BEY Datasheet - Page 9

IC TRIGGER NAND QUAD 2INP 14-DIP

HCF4093BEY

Manufacturer Part Number
HCF4093BEY
Description
IC TRIGGER NAND QUAD 2INP 14-DIP
Manufacturer
STMicroelectronics
Series
4000Br
Datasheets

Specifications of HCF4093BEY

Logic Type
NAND Gate
Number Of Inputs
2
Number Of Circuits
4
Current - Output High, Low
6.8mA, 6.8mA
Voltage - Supply
3 V ~ 20 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Product
NAND
Logic Family
HCF40
High Level Output Current
- 2.4 mA
Low Level Output Current
2.4 mA
Propagation Delay Time
380 ns
Supply Voltage (max)
20 V
Supply Voltage (min)
3 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Capacitance, Input
5 pF (Typ.) @ 25 °C
Circuit Type
Monolithic Integrated
Current, Input, Leakage
30 to 600 μA (Max.) (Quiescent)
Current, Supply
600 μA
Function Type
2-Inputs
Logic Function
NAND Gate
Package Type
DIP-14
Power Dissipation
200 mW
Special Features
Schmitt-Trigger
Temperature, Operating, Maximum
125 °C
Temperature, Operating, Minimum
-55 °C
Temperature, Operating, Range
-55 to +125 °C
Time, Delay, Propagation
190 ns (Typ.)
Voltage, Supply
3 to 20 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
497-1372-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCF4093BEY
Manufacturer:
AD
Quantity:
4 300
Part Number:
HCF4093BEY
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
HCF4093BEY
Quantity:
10 000
Part Number:
HCF4093BEY(DIP-14)
Manufacturer:
ST
0
HCF4093
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 5.
1. Drawing not to scale.
Table 8.
Symbol
a1
b1
e3
B
D
E
b
e
F
L
Z
I
Plastic DIP-14 package outline
Plastic DIP-14 mechanical data
0.51
1.39
1.27
Min
millimeters
15.24
0.25
2.54
Typ
0.5
8.5
3.3
Max
1.65
2.54
7.1
5.1
20
0.020
0.055
0.050
Min
Package mechanical data
inches
0.020
0.010
0.335
0.100
0.600
0.130
Typ
P001A
0.065
0.787
0.280
0.201
0.100
Max
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