NTD50N03R-1 ONSEMI [ON Semiconductor], NTD50N03R-1 Datasheet - Page 7

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NTD50N03R-1

Manufacturer Part Number
NTD50N03R-1
Description
Power MOSFET
Manufacturer
ONSEMI [ON Semiconductor]
Datasheet
V
S
SEATING
PLANE
−T−
F
V
S
F
1
B
R
G
4
2
1
G
3
B
R
4
2
L
3
A
K
D
2 PL
A
K
D
0.13 (0.005)
0.13 (0.005)
3 PL
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
J
0.228
5.80
J
M
M
C
T
T
−T−
C
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
E
0.244
SEATING
PLANE
0.101
6.20
2.58
U
E
H
http://onsemi.com
CASE 369C−01
CASE 369D−01
NTD50N03R
ISSUE O
ISSUE B
DPAK
DPAK
7
0.118
3.0
0.063
1.6
SCALE 3:1
Z
Z
6.172
0.243
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
ANSI Y14.5M, 1982.
STYLE 2:
DIM
PIN 1. GATE
A
B
C
D
G
H
K
R
E
F
J
S
V
Z
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION: INCH.
2. DRAIN
3. SOURCE
4. DRAIN
0.235
0.250
0.086
0.027
0.018
0.037
0.034
0.018
0.350
0.180
0.025
0.035
0.155
PER ANSI Y14.5M, 1982.
MIN
DIM
0.090 BSC
A
B
C
D
G
H
K
R
U
E
F
J
L
S
V
Z
INCHES
0.235
0.250
0.086
0.027
0.018
0.037
0.034
0.018
0.102
0.180
0.025
0.020
0.035
0.155
0.245
0.265
0.094
0.035
0.023
0.045
0.040
0.023
0.380
0.215
0.040
0.050
MIN
MAX
0.180 BSC
0.090 BSC
−−−
INCHES
0.245
0.265
0.094
0.035
0.023
0.045
0.040
0.023
0.215
0.040
0.050
0.114
MAX
MILLIMETERS
−−−
−−−
5.97
6.35
2.19
0.69
0.46
0.94
0.87
0.46
8.89
4.45
0.63
0.89
3.93
MIN
2.29 BSC
MILLIMETERS
5.97
6.35
2.19
0.69
0.46
0.94
0.87
0.46
2.60
4.57
0.63
0.51
0.89
3.93
MIN
MAX
6.35
6.73
2.38
0.88
0.58
1.14
1.01
0.58
9.65
5.45
1.01
1.27
4.58 BSC
2.29 BSC
−−−
MAX
6.22
6.73
2.38
0.88
0.58
1.14
1.01
0.58
2.89
5.45
1.01
1.27
−−−
−−−

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