k9f2g08uxa Samsung Semiconductor, Inc., k9f2g08uxa Datasheet - Page 13

• Manufacturer Part Number: k9f2g08uxa
• Description: 256m X 8 Bit Nand Flash Memory
• Manufacturer: Samsung Semiconductor, Inc.

K9F2G08R0A
K9F2G08U0A
AC Timing Characteristics for Command / Address / Data Input
NOTES : 1. The transition of the corresponding control pins must occur only once while WE is held low
Program / Erase Characteristics
NOTE : 1. Typical value is measured at Vcc=3.3V, T
CLE Setup Time
CLE Hold Time
CE Setup Time
CE Hold Time
WE Pulse Width
ALE Setup Time
ALE Hold Time
Data Setup Time
Data Hold Time
Write Cycle Time
WE High Hold Time
Address to Data Loading Time
Program Time
Dummy Busy Time for Two-Plane Page Program
Number of Partial Program Cycles
Block Erase Time
2. Typical program time is defined as the time within which more than 50% of the whole pages are programmed at 3.3V Vcc and 25
2. tADL is the time from the WE rising edge of final address cycle to the WE rising edge of first data cycle
Parameter
Parameter
A
Symbol
=25°C. Not 100% tested.
t
t
t
t
t
CLS
ALS
ADL
t
t
t
t
CS
t
DS
t
t
CLH
ALH
WP
WC
WH
CH
DH
(1)
(1)
(1)
(1)
(2)
Symbol
1.8V
100
21
25
21
21
20
42
15
t
t
t
5
5
5
5
PROG
Nop
DBSY
BERS
13
Min
3.3V
100
12
20
12
12
12
25
10
Min
5
5
5
5
-
-
-
-
1.8V
Typ
200
0.5
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
FLASH MEMORY
Max
3.3V
Max
700
-
-
-
-
-
-
-
-
-
-
-
-
1
4
2
°
C temperature
cycles
Unit
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
µs
µs
.