em784su16am Emlsi Inc., em784su16am Datasheet - Page 3

• Manufacturer Part Number: em784su16am
• Description: 512k X 16 Bit Pseudo Sram Specification
• Manufacturer: Emlsi Inc.

PAD DESCRIPTION
Note :
GENERAL WAFER SPECIFICATIONS
- Process Technology : 0.09um CMOS Deep trench process
- 3 Metal layers including local inter-connection
- Pad Open : 75.0um x 65.0um
- Minimum Pad Pitch : 80um
- Wafer diameter : 12-inch
CS#
OE#
WE#
ZZ#
DQ
A
DNU
Name
0-18
0-15
ZZ# pin should be connected with VCC in EM784SU16AM, EM784SU16AP, EM784SU16AS.
Chip select input
Output enable input
Write enable input
Low power control
Data in-out
Address inputs
Do not use
Function
LB#
UB#
VCC
VCCQ
VSS(Q) Ground
NC
Name
Lower byte (DQ
Upper byte (DQ
Power supply
I/O power supply
No connection
Function
0~7
8~15
)
)
3
512Kx16 Pseudo Static RAM
EM784SU16Ax