TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 8

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Y1
X (8x)
C1
C
Dimensions
Y2
Y3
G1
Y1
Y2
Y3
X2
C
G
Y
X
Y (8x)
POWERDI
X2
8
1
G1
SM-8
X
G
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
X1
Value (in mm)
G
®
3333-8
Dimensions
5
4
0.650
0.230
0.420
3.700
2.250
1.850
0.700
2.370
0.420
C1
Y1
C
X
Y
Y1
Y
X
Value (in mm)
Y
1.52
0.95
2.80
6.80
POWERDI
4.6
www.diodes.com
8 of 14
®
123 Type B
Y
X
C2
Y
Dimensions
Dimensions
Y1
G1
X1
X2
Y1
Y2
Y3
C
G
X
Y
POWERDI
X1
G
X
Y
C1
X2 (8x)
C
SO-8
X1
X
Value (in mm)
®
5060-8
(in mm)
Dimensions Value (in mm)
Value
2.000
1.050
4.100
1.500
G
1.270
0.660
0.820
4.420
4.100
0.610
6.610
3.810
1.020
1.270
C1
C2
X
Y
Y2
G1
Y3 (4x)
Suggested Pad Layout
© Diodes Incorporated
0.60
1.55
1.27
5.4