TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 7

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Y
Y
X
X
C2
Y1
X1
C
Dimensions
(2x)
Y1
Y
X1
Y1
C
G
X
Y
C1
DF-S / MiniDIP
MSOP-8L-EP
POWERDI
Z
(2x)
X1
Value (in mm)
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Dimensions DF-S MiniDIP
Dimensions Value (in mm)
®
1.840
0.852
3.360
1.390
4.860
1.400
5
C1
C2
X
Y
C
X1
Y1
Z
X
Y
G
10.26
1.52
1.2
5.2
0.65
0.32
1.95
1.65
4.2
0.8
6.91
0.60
0.76
2.67
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Y
Y
X
C2
X
Y2
C2
Dimensions POWERDI
X1
X2
Y1
Y2
G
POWERDI
C1
X1
C1
®
MSOP-10
123 / POWERDI
MSOP-8
1.0
2.2
0.9
1.4
1.4
®
Dimensions
123 POWERDI
Dimensions Value (in mm)
G
C1
C2
X
Y
C1
C2
X
Y
®
323
X2
Suggested Pad Layout
0.5
2.0
0.8
0.8
1.1
Value (in mm)
®
323
© Diodes Incorporated
0.45
0.65
1.4
4.4
0.30
0.50
Y1
1.4
4.4