TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 4

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

X2
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Y1
G
X
Y
c1
G1
X1
X
C
Z
c
C
X1
Y1
Y1
Y
Y2
U-DFN2020-3
U-DFN2020-6
U-DFN2510-8
X1
Type B
Type B
G
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Y
G
Dimensions
Dimensions
Dimensions
X1
Y1
Y2
G1
X1
X2
Y1
C
G
G
X
Y
Z
Y
C
c1
X1
Y1
G
X
Y
c
(in mm)
(in mm)
Value
Value
1.30
0.24
0.35
1.52
1.09
0.47
0.50
1.67
0.20
0.40
0.45
0.37
0.70
0.65
1.0
(in mm)
Value
0.5
1.0
0.2
0.2
0.4
0.6
1.4
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X (6x)
Y3
Y3
Y2
X2
Y2
Y
X2
C
Y
Z
X1
C
C
X
X1
U-DFN2020-6
U-DFN2020-6
U-DFN2523-6
X1
G
G
Type E
Y (2x)
Y1
Y
Y1
Dimensions Value (in mm)
Dimensions
Dimensions
X1
Y1
Y2
Y3
C
X
Y
X1
X2
Y1
Y2
Y3
C
X
Y
X1
X2
G
Y
C
Z
Suggested Pad Layout
© Diodes Incorporated
(in mm)
0.650
0.400
1.700
0.650
0.450
1.830
2.700
(in mm)
Value
0.650
0.400
0.285
1.050
0.500
0.920
1.600
2.300
Value
1.67
0.15
0.90
0.45
0.37
0.65