TSSOP-14 DIODES [Diodes Incorporated], TSSOP-14 Datasheet - Page 12

• Manufacturer Part Number: TSSOP-14
• Description: SUGGESTED PAD LAYOUT
• Manufacturer: DIODES [Diodes Incorporated]

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
Y3
Y
X (3x)
X2 (2x)
X1
Y2
C
Y4
Y1
Y2
SOT89-3
Y1
Y1
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Y (6X)
X2
Dimensions Value (in mm)
E1
Y1
X (6X)
X1
X2
Y1
Y2
Y3
Y4
X
Y
C
C
X (4x)
Z
C
X1
c1
TO252 (DPAK) / TO263 (D
C
0.900
1.733
0.416
1.300
4.600
1.475
0.950
1.125
1.500
c
Y3
Y2
Y
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Dimensions
TO252-4
SOT963
12 of 14
X1
X2
Y1
Y2
E1
C
Z
Dimensions
Y2
X1
Y1
Y2
Y3
c1
X
Y
c
Dimensions Value (in mm)
TO252 / DPAK TO263 / D
X2
2
PAK)
Y1
11.6
C
X
Y
X3
1.5
7.0
2.5
7.0
6.9
2.3
X1
C
Value (in mm)
Y4
Y3
1.27
2.54
1.00
5.73
2.00
6.17
1.64
2.66
0.350
0.200
0.200
1.100
Y1
SOT89-5
16.9
10.8
11.4
1.1
3.5
9.5
2.5
2
PAK
Dimensions Value (in mm)
X1
X2
X3
Y1
Y2
Y3
Y4
C
Suggested Pad Layout
© Diodes Incorporated
0.55
1.7
0.4
4.6
1.2
0.5
1.1
3.0