ax5042-1 AXSEM, ax5042-1 Datasheet - Page 43

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ax5042-1

Manufacturer Part Number
ax5042-1
Description
Rf Transceiver
Manufacturer
AXSEM
Datasheet

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6.
7.
Version 2.2
The fine pitch of the IC leads requires accurate alignment of the stencil and the printed
circuit board. The stencil and printed circuit assembly should be aligned to within + 1 mil
prior to application of the solder paste.
No-clean flux is recommended since flux from underneath the thermal pad will be
difficult to clean if water-soluble flux is used.
50% coverage
Minimum
Figure 9: Solder paste application on exposed pad
Figure 10: Solder paste application on pins
62% coverage
QFN28 Package Information
80% coverage
Maximum
Datasheet AX5042
43

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