mtsf1p02hdr2 Freescale Semiconductor, Inc, mtsf1p02hdr2 Datasheet
![no-image](/images/manufacturer_photos/0/2/263/freescale_semiconductor__inc_sml.jpg)
mtsf1p02hdr2
Related parts for mtsf1p02hdr2
mtsf1p02hdr2 Summary of contents
Page 1
... DEVICE MARKING AB AB MTSF1P02HDR2 This document contains information on a new product. Specifications and information are subject to change without notice. Preferred devices are Motorola recommended choices for future use and best overall value. HDTMOS is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Micro8 is a registered trademark of International Rectifier ...
Page 2
MTSF1P02HD ( 25°C unless otherwise noted) (1) ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc, ...
Page 3
TYPICAL ELECTRICAL CHARACTERISTICS 4.5 V 1.8 V 2 1.7 V 1.9 V 1.2 1.6 V 0.8 1.5 V 0.4 1 0.4 0.8 1 DRAIN–TO–SOURCE VOLTAGE (VOLTS) ...
Page 4
MTSF1P02HD Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by ...
Page 5
TOTAL GATE CHARGE (nC) Figure 8. Gate–To–Source and Drain–To–Source Voltage versus Total Charge DRAIN–TO–SOURCE DIODE CHARACTERISTICS The switching characteristics of a ...
Page 6
MTSF1P02HD The Forward Biased Safe Operating Area curve (Figure 12) defines the maximum simultaneous drain–to–source vol- tage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and ...
Page 7
TYPICAL ELECTRICAL CHARACTERISTICS 1000 D = 0.5 100 0.2 0.1 0.05 10 0.02 0.01 1 SINGLE PULSE 0.1 1.0E–05 1.0E–04 1.0E– Figure 15. Diode Reverse Recovery Waveform Motorola TMOS Power MOSFET Transistor Device Data P (pk ...
Page 8
MTSF1P02HD INFORMATION FOR USING THE Micro8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ...
Page 9
For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings ...
Page 10
MTSF1P02HD Micro8 Dimensions are shown in millimeters (inches) 2.05 (.080) 1.95 (.077) 4.10 (.161) PIN NUMBER 1 3.90 (.154) 12.30 11.70 (.484) (.461) FEED DIRECTION NOTES: 1. CONFORMS TO EIA–481–1. 2. CONTROLLING DIMENSION: MILLIMETER. 330.0 (13.20) MAX. NOTES: 1. CONFORMS ...
Page 11
K PIN SEATING –T– PLANE 0.038 (0.0015) H Motorola TMOS Power MOSFET Transistor Device Data PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, ...
Page 12
MTSF1P02HD Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out ...