mt58l512v18p ETC-unknow, mt58l512v18p Datasheet - Page 17

• Manufacturer Part Number: mt58l512v18p
• Description: 512k 256k 32/36 Pipelined, Syncburst Sram
• Manufacturer: ETC-unknow

TQFP THERMAL RESISTANCE
FBGA THERMAL RESISTANCE
NOTE: 1. This parameter is sampled.
8Mb: 512K x 18, 256K x 32/36 Pipelined, SCD SyncBurst SRAM
MT58L512L18P_C.p65 – Rev. 2/02
DESCRIPTION
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Top of Case)
DESCRIPTION
Junction to Ambient
(Airflow of 1m/s)
Junction to Case (Top)
Junction to Pins
(Bottom)
2. Preliminary package data.
methods and procedures for measuring
thermal impedance, per EIA/JESD51.
Test conditions follow standard test
Test conditions follow standard test methods
and procedures for measuring thermal
impedance, per EIA/JESD51.
CONDITIONS
CONDITIONS
17
PIPELINED, SCD SYNCBURST SRAM
8Mb: 512K x 18, 256K x 32/36
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1-layer
SYMBOL
SYMBOL
JA
JA
JC
JC
JB
TYP
TYP
40
40
17
8
9
©2002, Micron Technology, Inc.
UNITS NOTES
UNITS NOTES
°C/W
°C/W
°C/W
°C/W
°C/W
1, 2
1, 2
1, 2
1
1