hx6228 Mospec Semiconductor Corp., hx6228 Datasheet - Page 9
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hx6228
Manufacturer Part Number
hx6228
Description
128k X 8 Static Ram-soi Hx6228
Manufacturer
Mospec Semiconductor Corp.
Datasheet
1.HX6228.pdf
(12 pages)
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QUALITY AND RADIATIONHARDNESS
ASSURANCE
Honeywell maintains a high level of product integrity through
process control, utilizing statistical process control, a com-
plete “Total Quality Assurance System,” a computer data
base process performance tracking system, and a radia-
tion hardness assurance strategy.
The radiation hardness assurance strategy starts with a
technology that is resistant to the effects of radiation.
Radiation hardness is assured on every wafer by irradiat-
ing test structures as well as SRAM product, and then
monitoring key parameters which are sensitive to ionizing
radiation. Conventional MIL-STD-883 TM 5005 Group E
testing, which includes total dose exposure with Cobalt 60,
may also be performed as required. This Total Quality
approach ensures our customers of a reliable product by
engineering in reliability, starting with process develop-
ment and continuing through product qualification and
screening.
SCREENING LEVELS
Honeywell offers several levels of device screening to
meet your system needs. “Engineering Devices” are avail-
able with limited performance and screening for bread-
boarding and/or evaluation testing. Hi-Rel Level B and S
devices undergo additional screening per the require-
ments of MIL-STD-883. As a QML supplier, Honeywell
also offers QML Class Q and V devices per MIL-PRF-
38535 and are available per the applicable Standard
Microcircuits Drawing (SMD). QML devices offer ease of
TESTER AC TIMING CHARACTERISTICS
Levels*
Output
Levels
Sense
Input
* Input rise and fall times <1 ns/V
High Z
TTL I/O Configuration
3 V
0 V
High Z = 2.9V
3.4 V
2.4 V
VDD-0.4V
0.4 V
High Z
1.5 V
1.5 V
9
procurement by eliminating the need to create detailed
specifications and offer benefits of improved quality and
cost savings through standardization.
RELIABILITY
Honeywell understands the stringent reliability require-
ments that space and defense systems require and has
extensive experience in reliability testing on programs of
this nature. This experience is derived from comprehen-
sive testing of VLSI processes. Reliability attributes of the
RICMOS™ process were characterized by testing spe-
cially designed irradiated and non-irradiated test struc-
tures from which specific failure mechanisms were evalu-
ated. These specific mechanisms included, but were not
limited to, hot carriers, electromigration and time depend-
ent dielectric breakdown. This data was then used to make
changes to the design models and process to ensure more
reliable products.
In addition, the reliability of the RICMOS™ process and
product in a military environment was monitored by testing
irradiated and non-irradiated circuits in accelerated dy-
namic life test conditions. Packages are qualified for prod-
uct use after undergoing Groups B & D testing as outlined
in MIL-STD-883, TM 5005, Class S. The product is quali-
fied by following a screening and testing flow to meet the
customer’s requirements. Quality conformance testing is
performed as an option on all production lots to ensure the
ongoing reliability of the product.
High Z
VDD-0.5 V
CMOS I/O Configuration
High Z = 2.9V
0.5 V
3.4 V
2.4 V
VDD-0.4V
0.4 V
VDD/2
High Z
VDD/2
HX6228