hys64t128021hdl-3-b Infineon Technologies Corporation, hys64t128021hdl-3-b Datasheet - Page 7

• Manufacturer Part Number: hys64t128021hdl-3-b
• Description: 200-pin So-dimm Ddr2 Sdram Modules
• Manufacturer: Infineon Technologies Corporation

Table 3
Product Type
HYS64T64020HDL–5–B
HYS64T128021HDL–5–B
1) All part numbers end with a place code, designating the silicon die revision. Example: HYS64T16000HU–5–A, indicating
2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200U–444–11–
Table 4
DIMM
Density
256 MByte
512 MByte
1 GByte
Table 5
Product Type
HYS64T32000HU
HYS64T64020HU
HYS64T128021HU
1) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
2) Green Product
Data Sheet
Rev. “B” dies are used for DDR2 SDRAM components. For all INFINEON DDR2 module and component nomenclature see
Chapter 6
A0”, where 4200U means Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-11” means Column
Address Strobe (CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the
latest JEDEC SPD Revision 1.1 and produced on the Raw Card “C”.
Ordering Information for RoHS Compliant Products (cont’d)
Address Format
Components on Modules
of this data sheet.
Module
Organization
32M
64M
128M
1)
2)
64
64
64
DRAM Components
HYB18T512160BF
HYB18T512160BF
HYB18T512800BF
Compliance Code
512 MB 1R 16 PC2–3200S–333–12–A0
1 GB 2Rx8 PC2-3200S–333–12–E0
Memory
Ranks
1
2
2
1)
2)
2)
ECC/
Non-ECC
Non-ECC
Non-ECC
Non-ECC
7
DRAM Density
512 Mbit
512 Mbit
512 Mbit
HYS64T[32/64/128]xxxHDL-[2.5/…/5]-B
# of
SDRAMs
4
8
16
SO-DIMM DDR2 SDRAM Module
2 Rank, Non-ECC
Description
2 Rank, Non-ECC
# of row/bank/column
bits
13/2/10
13/2/10
14/2/10
DRAM Organisation
32M
64M
64M
05122005-2TKP-OM7N
16
16
8
Rev 1.00, 2005-06
512 Mbit ( 8)
SDRAM
Technology
512 Mbit ( 16)
Overview
Raw
Card
C
A
E