mt18jsf25672ay-1g1 Micron Semiconductor Products, mt18jsf25672ay-1g1 Datasheet

mt18jsf25672ay-1g1

Manufacturer Part Number

mt18jsf25672ay-1g1

Description

2gb, 4gb X72, Ecc, Dr 240-pin Ddr3 Sdram Udimm

Manufacturer

Micron Semiconductor Products

Datasheet

1.MT18JSF25672AY-1G1.pdf (20 pages)

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DDR3 SDRAM UDIMM

MT18JSF25672A – 2GB

MT18JSF51272A – 4GB

For component data sheets, refer to Micron’s Web site:

Features

• DDR3 functionality and operations supported as

• 240-pin, unbuffered dual in-line memory module

• Fast data transfer rates: PC3-10600, PC3-8500,

• 2GB (256 Meg x 72), 4GB (512 Meg x 72)

• V

• Supports ECC error detection and correction

• Nominal and dynamic on-die termination (ODT) for

• Dual rank

• On-board I

• 8 internal device banks

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

• Selectable BC4 or BL8 on-the-fly (OTF)

• Gold edge contacts

• Lead-free

• Fly-by topology

• Terminated control, command, and address bus

Table 1:

PDF: 09005aef83014429/Source: 09005aef83014466

JSF18C256_512x72A.fm - Rev. C 5/08 EN

Speed

Grade

defined in the component data sheet

(UDIMM)

or PC3-6400

data, strobe, and mask signals

serial presence-detect (SPD) EEPROM

via the mode register set (MRS)

-1G5

-1G4

-1G3

-1G1

-1G0

-80C

-80B

DDSPD

= 1.5V ±0.075V

= +3.0V to +3.6V

Nomenclature

PC3-10600

Key Timing Parameters

Industry

PC3-8500

PC3-6400

C temperature sensor with integrated

Products and specifications discussed herein are subject to change by Micron without notice.

CL = 10

1333

–

CL = 9

1333

–

2GB, 4GB (x72, ECC, DR) 240-Pin DDR3 SDRAM UDIMM

Data Rate (MT/s)

CL = 8

1333

1066

–

www.micron.com

CL = 7

1066

Figure 1:

Notes: 1. Contact Micron for industrial temperature

Options

• Operating temperature

• Package

• Frequency/CAS latency

–

PCB height: 30.0mm (1.181in)

– Commercial (0°C ≤ T

– Industrial (–40°C ≤ T

– 240-pin DIMM (lead-free)

– 1.5ns @ CL = 8 (DDR3-1333)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.5ns @ CL = 10 (DDR3-1333)

– 1.87ns @ CL = 7 (DDR3-1066)

– 1.87ns @ CL = 8 (DDR3-1066)

– 2.5ns @ CL = 5 (DDR3-800)

– 2.5ns @ CL = 6 (DDR3-800)

Micron Technology, Inc., reserves the right to change products or specifications without notice.

2. Not recommended for new designs.

CL = 6

800

module offerings.

240-Pin UDIMM (MO-269 R/C E)

CL = 5

800

–

≤ +85°C)

≤ +70°C)

13.125

(ns)

12.5

13.5

RCD

13.125

(ns)

13.5

12.5

Marking

Features

None

-1G5

-1G4

-1G3

-1G1

-1G0

-80C

-80B

50.625

(ns)

49.5

52.5

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