mt18hts25672pky-53e Micron Semiconductor Products, mt18hts25672pky-53e Datasheet
mt18hts25672pky-53e
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mt18hts25672pky-53e Summary of contents
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... Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 244-Pin Mini-RDIMM (MO-244) ) Marking 1 ≤ +70°C) A ≤ +85° module offerings. will add one clock cycle to CL RCD RP (ns) (ns ©2006 Micron Technology, Inc. All rights reserved. ...
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... Notes: 1. Data sheets for the base devices can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT18HTS25672PKY- 667E1. PDF: 09005aef82218d23/Source: 09005aef82218d00 HTS18C256_512x72K.fm - Rev. B 9/07 EN ...
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Pin Assignments and Descriptions Table 5: Pin Assignments 244-Pin Mini-RDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol REF DQ24 DQ0 34 DQ25 65 4 DQ1 35 ...
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... DQ and DQS pins. If RDQS is disabled, DQS9–DQS17 become DM0–DM8 and DQS9#–DQS17# are not used. SDA I/O Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses and data (SSTL_18) into and out of the presence-detect portion of the module Output Parity error found on the address and control bus. Non-parity version is not used. RR ...
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... Symbol Type Description V Supply Ground – No connect: These pins are not connected on the module. NU – Not used: These pins are not required to be used. RFU – Reserved for future use. PDF: 09005aef82218d23/Source: 09005aef82218d00 HTS18C256_512x72K.fm - Rev. B 9/07 EN 2GB, 4GB (x72, DR) 244-Pin DDR2 Mini-RDIMM Pin Assignments and Descriptions Micron Technology, Inc ...
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Functional Block Diagram Figure 2: Functional Block Diagram RS1# RS0# DQS0 DQS0# DM0/RDQS0 NU/RDQS0# DM/ RDQS DQ DQ0 DQ DQ1 DQ DQ2 DQ3 DQ DQ DQ4 DQ DQ5 DQ DQ6 DQ DQ7 DQS1 DQS1# DM1/RDQS1 NU/RDQS1# DM/ RDQS DQ8 DQ ...
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... DDR2 SDRAM modules incorporate serial presence-detect (SPD). The SPD function is implemented using a 2,048-bit EEPROM. This nonvolatile storage device contains 256 bytes. The first 128 bytes are programmed by Micron to identify the module type and various SDRAM organizations and timing parameters. The remaining 128 bytes of storage are available for use by the customer ...
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... Electrical Specifications Stresses greater than those listed in Table 7 may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in the device data sheet are not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...
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I Specifications DD Table 9: I Specifications and Conditions – 2GB DD Values are shown for the MT47H256M8 DDR2 SDRAM only and are computed from values specified in the 2Gb TwinDie (256 Meg x 8) component data sheet Parameter/Condition Operating ...
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Table 10: I Specifications and Conditions – 4GB DD Values are shown for the MT47H512M8 DDR2 SDRAM only and are computed from values specified in the 4Gb TwinDie (512 Meg x 8) component data sheet Parameter/Condition Operating one bank active-precharge ...
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... Timing and switching specifications for the register listed above are critical for proper oper- ation of the DDR2 SDRAM registered DIMMs. These are meant subset of the param- eters for the specific device used on the module. Detailed information for this register is available in JEDEC standard JESD82. ...
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Table 12: PLL Specifications CU877 device or Equivalent JESD82-8.01 Parameter Symbol DC high-level input voltage low-level input voltage Input voltage (limits high-level input voltage IH DC low-level input voltage V IL ...
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Serial Presence-Detect Table 14: Serial Presence-Detect EEPROM DC Operating Conditions Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input leakage current GND ...
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... Number of SPD bytes used by Micron 1 Total number of bytes in SPD device 2 Fundamental memory type 3 Number of row addresses on DRAM 4 Number of column addresses on DRAM 5 DIMM height and module ranks 6 Module data width 7 Reserved 8 Module voltage interface levels t 9 SDRAM cycle time, CK (CL = MAX value, see ...
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... SPD revision 63 Checksum for bytes 0–62 ECC/ECC and parity 64 Manufacturer’s JEDEC ID code 65–71 Manufacturer’s JEDEC ID code 72 Manufacturing location 73–90 Module part number (ASCII) 91 PCB identification code 92 PCB identification code (continued) 93 Year of manufacture in BCD 94 Week of manufacture in BCD 95–98 Module serial number 99– ...
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... U9 U12 U11 3.6 (0.142) TYP 38.4 (1.512) TYP TYP ® property of their respective owners. characterization sometimes occur. 16 Module Dimensions U6 30.152 (1.187) 29.848 (1.175) 20.0 (0.787) TYP 10.0 (0.394) TYP Pin 122 U13 Pin 123 Micron Technology, Inc., reserves the right to change products or specifications without notice. ...